鈩?/div>
T
C
= 25擄C
6
200
3
54
-55 ... +150
150
-55 ... +150
G
S
D (TAB)
G = Gate,
S = Source,
D = Drain,
TAB = Drain
Mounting torque
1.13/10 Nm/lb.in.
4
300
g
擄C
Features
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
聼
International standard packages
聼
High voltage, Low R
DS (on)
HDMOS
TM
process
聼
Rugged polysilicon gate cell structure
聼
Fast switching times
Symbol
Test Conditions
Characteristic Values
(T
J
= 25擄C, unless otherwise specified)
min. typ. max.
1000
2.5
4.5
鹵100
T
J
= 25擄C
T
J
= 125擄C
25
500
11
V
V
nA
碌A(chǔ)
碌A(chǔ)
鈩?/div>
Applications
聼
Switch-mode and resonant-mode
power supplies
聼
Flyback inverters
聼
DC choppers
聼
High frequency matching
Advantages
V
DSS
V
GS(th)
I
GSS
I
DSS
R
DS(on)
V
GS
= 0 V, I
D
= 250
碌A(chǔ)
V
DS
= V
GS
, I
D
= 25
碌A(chǔ)
V
GS
=
鹵20
V
DC
, V
DS
= 0
V
DS
= V
DSS
V
GS
= 0 V
V
GS
= 10 V, I
D
= 1.0A
Pulse test, t
鈮?/div>
300
碌s,
duty cycle d
鈮?/div>
2 %
聼
Space savings
聼
High power density
IXYS reserves the right to change limits, test conditions, and dimensions.
98545A (11/99)
漏 2000 IXYS All rights reserved
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