= 1 M鈩?/div>
Continuous
Transient
T
C
= 25擄C
T
C
= 25擄C, pulse width limited by T
JM
T
C
= 25擄C
Maximum Ratings
800
800
鹵20
鹵30
14
56
300
-55 ... +150
150
-55 ... +150
擄C
1.13/10 Nm/lb.in.
6
g
V
V
V
V
A
A
W
擄C
擄C
擄C
TO-247 AD
D (TAB)
G = Gate,
S = Source,
D = Drain,
TAB = Drain
Max. lead temperature for soldering 300
1.6 mm (0.063 in) from case for 10 s
M
d
Weight
Mounting torque
Features
International standard package
Low R
DS (on)
HDMOS
TM
process
Rugged polysilicon gate cell structure
Low package inductance (< 5 nH)
- easy to drive and to protect
Fast switching times
l
l
l
l
l
l
l
l
l
l
l
l
Symbol
Test Conditions
Characteristic Values
(T
J
= 25擄C, unless otherwise specified)
min. typ. max.
800
2
4.5
鹵100
T
J
= 25擄C
T
J
= 125擄C
250
1
0.7
V
V
nA
碌A(chǔ)
mA
鈩?/div>
Applications
Switch-mode and resonant-mode
power supplies
Motor control
Uninterruptible Power Supplies (UPS)
DC choppers
V
DSS
V
GS(th)
I
GSS
I
DSS
R
DS(on)
V
GS
= 0 V, I
D
= 3 mA
V
DS
= V
GS
, I
D
= 250
碌A(chǔ)
V
GS
=
鹵20
V
DC
, V
DS
= 0
V
DS
= 0.8 鈥?V
DSS
V
GS
= 0 V
Advantages
Easy to mount with 1 screw
(isolated mounting screw hole)
Space savings
High power density
V
GS
= 10 V, I
D
= 0.5 I
D25
Pulse test, t
鈮?/div>
300
碌s,
duty cycle d
鈮?/div>
2 %
IXYS reserves the right to change limits, test conditions, and dimensions.
96518F(12/97)
漏 2000 IXYS All rights reserved
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