HiPerFAST
TM
IGBT
IXGH30N30
V
CES
I
C25
V
CE(sat)
t
fi
=
=
=
=
300 V
60 A
1.6 V
180 ns
Preliminary data
Symbol
V
CES
V
CGR
V
GES
V
GEM
I
C25
I
C90
I
CM
SSOA
(RBSOA)
P
C
T
J
T
JM
T
stg
Test Conditions
T
J
= 25擄C to 150擄C
T
J
= 25擄C to 150擄C; R
GE
= 1 MW
Continuous
Transient
T
C
= 25擄C
T
C
= 90擄C
T
C
= 25擄C, 1 ms
V
GE
= 15 V, T
VJ
= 125擄C, R
G
= 10
W
I
CM
= 60
Clamped inductive load, L = 100
mH
@ 0.8 V
CES
T
C
= 25擄C
Maximum Ratings
300
300
鹵20
鹵30
60
30
120
A
200
-55 ... +150
150
-55 ... +150
300
260
1.13/10
TO-247 AD
6
W
擄C
擄C
擄C
擄C
擄C
Nm/lb.in.
g
V
V
V
V
A
A
A
TO-247 AD
C (TAB)
G
C
E
C = Collector,
TAB = Collector
G = Gate,
E = Emitter,
Features
路
International standard package
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
Maximum Tab temperature for soldering SMD devices for 10 s
M
d
Weight
Mounting torque (M3)
JEDEC TO-247 AD
路
High current handling capability
路
Newest generation HDMOS
TM
process
路
MOS Gate turn-on
- drive simplicity
Applications
路
路
路
路
路
Symbol
Test Conditions
Characteristic Values
(T
J
= 25擄C, unless otherwise specified)
min. typ. max.
300
2.5
5
200
1
鹵100
nA
1.6
V
V
V
mA
mA
AC motor speed control
DC servo and robot drives
DC choppers
Uninterruptible power supplies (UPS)
Switched-mode and resonant-mode
power supplies
BV
CES
V
GE(th)
I
CES
I
GES
V
CE(sat)
I
C
I
C
= 250
mA,
V
GE
= 0 V
= 250
mA,
V
CE
= V
GE
T
J
= 25擄C
T
J
= 125擄C
Advantages
路
High power density
路
Suitable for surface mounting
路
Switching speed for high frequency
V
CE
= 0.8 鈥?V
CES
V
GE
= 0 V
V
CE
= 0 V, V
GE
= 鹵20 V
I
C
= I
C90
, V
GE
= 15 V
applications
路
Easy to mount with 1 screw,
(isolated mounting screw hole)
IXYS reserves the right to change limits, test conditions, and dimensions.
96542C (7/00)
漏 2000 IXYS All rights reserved
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