HiPerFAST
TM
IGBT
IXGH 28N30
IXGT 28N30
V
CES
I
C25
V
CE(sat)typ
t
fi(typ)
= 300 V
= 56 A
= 1.6 V
= 180 ns
Preliminary data
Symbol
V
CES
V
CGR
V
GES
V
GEM
I
C25
I
C90
I
CM
SSOA
(RBSOA)
P
C
T
J
T
JM
T
stg
Test Conditions
T
J
= 25擄C to 150擄C
T
J
= 25擄C to 150擄C; R
GE
= 1 MW
Continuous
Transient
T
C
= 25擄C
T
C
= 90擄C
T
C
= 25擄C, 1 ms
V
GE
= 15 V, T
VJ
= 125擄C, R
G
= 10
W
Clamped inductive load, L = 100
mH
T
C
= 25擄C
Maximum Ratings
300
300
鹵20
鹵30
56
28
112
I
CM
= 56
@ 0.8 V
CES
150
-55 ... +150
150
-55 ... +150
300
260
V
V
V
V
A
A
A
A
TO-268
(IXGT)
G
E
(TAB)
TO-247 AD
G
C (TAB)
C
E
C = Collector,
TAB = Collector
W
擄C
擄C
擄C
擄C
擄C
G = Gate,
E = Emitter,
Maximum Lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
Maximum Tab temperature for soldering SMD devices for 10 s
M
d
Weight
Mounting torque (M3)
1.13/10 Nm/lb.in.
TO-247 AD
TO-268
6
4
g
g
Features
鈥?International standard packages
JEDEC TO-268 surface and
JEDEC TO-247 AD
鈥?High current handling capability
鈥?Newest generation HDMOS
TM
process
鈥?MOS Gate turn-on
- drive simplicity
Applications
鈥?AC motor speed control
鈥?DC servo and robot drives
鈥?DC choppers
鈥?Uninterruptible power supplies (UPS)
鈥?Switched-mode and resonant-mode
power supplies
Advantages
鈥?High power density
鈥?Suitable for surface mounting
鈥?Switching speed for high frequency
applications
鈥?Easy to mount with 1 screw,
(isolated mounting screw hole)
97528A (9/98)
Symbol
Test Conditions
Characteristic Values
(T
J
= 25擄C, unless otherwise specified)
min. typ. max.
300
2.5
T
J
= 25擄C
T
J
= 125擄C
V
V
mA
mA
nA
V
BV
CES
V
GE(th)
I
CES
I
GES
V
CE(sat)
I
C
I
C
= 250
mA,
V
GE
= 0 V
= 250
mA,
V
CE
= V
GE
5
200
1
鹵100
1.6
1.8
V
CE
= 0.8 鈥?V
CES
V
GE
= 0 V
V
CE
= 0 V, V
GE
=
鹵20
V
I
C
= I
C90
, V
GE
= 15 V
IXYS reserves the right to change limits, test conditions, and dimensions.
漏 2000 IXYS All rights reserved
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