鈩?/div>
T
C
= 25擄C
230
-40 ... +150
150
-40 ... +150
300
2500
11...65 / 2.5...15
2
W
擄
C
擄
C
擄
C
擄
C
V
N/lb
g
Maximum Ratings
800
800
鹵20
鹵30
13
60
15
30
1.0
10
V
V
V
V
A
A
A
mJ
J
V/ns
G = Gate
S = Source
Features
Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
Low drain to tab capacitance(<35pF)
Low R
DS (on)
Rugged polysilicon gate cell structure
Unclamped Inductive Switching (UIS)
rated
Fast intrinsic Rectifier
Applications
DC-DC converters
Battery chargers
Switched-mode and resonant-mode
power supplies
DC choppers
AC motor control
Advantages
Easy assembly: no screws or isolation
foils required
Space savings
High power density
G
D
S
Isolated back surface*
D = Drain
Symbol
Test Conditions
(T
J
= 25擄C, unless otherwise specified)
V
DSS
V
GS(th)
I
GSS
I
DSS
R
DS(on)
V
GS
= 0 V, I
D
= 3 mA
V
DS
= V
GS
, I
D
= 4 mA
V
GS
=
鹵20
V
DC
, V
DS
= 0
V
DS
= V
DSS
V
GS
= 0 V
T
J
= 25擄C
T
J
= 125擄C
Characteristic Values
Min. Typ.
Max.
800
2.0
4.5
鹵100
25
1
0.65
V
V
nA
碌A(chǔ)
mA
鈩?/div>
V
GS
= 10 V, I
D
= 0.5 I
D25
Pulse test, t
鈮?/div>
300
碌s,
duty cycle d
鈮?/div>
2 %
See IXFH15N80Q data sheet for
characteristic curves
漏 2003 IXYS All rights reserved
DS98946B(07/03)
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