ITF87072DK8T
TM
Data Sheet
March 2000
File Number
4812.3
6A, 20V, 0.037 Ohm, Dual P-Channel,
2.5V Speci鏗乪d Power MOSFET
Packaging
SO8 (JEDEC MS-012AA)
BRANDING DASH
Features
鈥?Ultra Low On-Resistance
- r
DS(ON)
= 0.037鈩?
V
GS
= 鈭?.5V
- r
DS(ON)
= 0.039鈩?
V
GS
= 鈭?.0V
- r
DS(ON)
= 0.059鈩?
V
GS
= 鈭?.5V
鈥?Gate to Source Protection Diode
鈥?Simulation Models
- Temperature Compensated PSPICE鈩?and SABER
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.intersil.com
鈥?Peak Current vs Pulse Width Curve
鈥?Transient Thermal Impedance Curve vs Board Mounting
Area
5
1
2
3
4
Symbol
DRAIN1(8)
DRAIN1(7)
SOURCE1(1)
GATE1(2)
DRAIN2(6)
DRAIN2(5)
SOURCE2(3)
GATE2(4)
鈥?Switching Time vs R
GS
Curve
Ordering Information
PART NUMBER
ITF87072DK8T
PACKAGE
SO8
87072
BRAND
NOTE: When ordering, use the entire part number. ITF87072DK8T
is available only in tape and reel.
Absolute Maximum Ratings
T
A
= 25
o
C, Unless Otherwise Specified
ITF87072DK8T
-20
-20
鹵12
6.0
6.0
1.5
1.5
Figure 4
2.5
20
-55 to 150
300
260
UNITS
V
V
V
A
A
A
A
W
mW/
o
C
o
C
o
C
o
C
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
Drain to Gate Voltage (R
GS
= 20k鈩? (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Drain Current
Continuous (T
A
= 25
o
C, V
GS
= -4.5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
A
= 25
o
C, V
GS
= -4.0V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
A
= 100
o
C, V
GS
= -4.0V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
A
= 100
o
C, V
GS
= -2.5V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
DM
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
L
Package Body for 10s, See Technical Brief TB370 . . . . . . . . . . . . . . . . . . . . . . . . . . . T
pkg
CAUTION:
Stresses above those listed in 鈥淎bsolute Maximum Ratings鈥?may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this speci鏗乧ation is not implied.
NOTES:
1. T
J
= 25
o
C to 125
o
C.
2. 50
o
C/W measured using FR-4 board with 0.14 in
2
(90.3 mm
2
) copper pad at 1 second.
3. 228
o
C/W measured using FR-4 board with 0.006 in
2
(3.9 mm
2
) copper pad at 1000 second.
1
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.
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漏
Intersil Corporation 2000