廬
ISL6597
Data Sheet
September 2004
FN9165
PRELIMINARY
ISL6597 Integrated Power Stage
The ISL6597 is a high performance power stage for the
highest power density server and workstation buck
regulation solutions. The ISL6597 combined with the
ISL6592 Digital Multiphase Controller offers a complete high
current, small form factor solution with superior accuracy,
transient response, and protection features.
The ISL6597 integrates a low r
(DSON)
high-side P-Channel
MOSFET together with both high-side and low-side
MOSFET drivers. The integration of the high-side power
FET with high- and low-side drivers minimizes switching
losses while providing industry leading power density. A
maximum peak output current of 30A per phase is supported
in an area less than 16mm
2
, smaller than most discrete
power MOSFETs. The ISL6597 low-side driver supply
(VDRIVE) may be biased separately from the VCC supply
from 5V to 12V to optimize the system efficiency.
The ISL6597 has a patent pending lossless current sensor
which accurately senses the current in the high-side FET
independent of VID, inductor value, supply, temperature, and
switching frequencies. This integrated current sense method
provides the accuracy of precision resistor based sensing
with no efficiency loss.
The ISL6597 has an integrated high-side FET short detector
which reacts rapidly on startup to protect the processor
before the controller is powered up. The output high-side
short pins from each phase can drive a single external
crowbar circuitry for rapid protection from a high-side short
on any phase of a multiphase solution. The high-side short
pin also acts as an input, detecting alert signals from every
ISL6597 power stage in the system and protecting each
power stage internally as well.
The ISL6597 also has an integrated junction temperature
sensor which provides an on-die measurement of the high-
side FET temperature. When used with the ISL6592
controller, this feature provides very accurate,
programmable over-temperature protection.
The ISL6597 uses CSP packaging to provide the lowest
thermal resistance and smallest footprint. A relaxed 0.65mm
ball pitch allows for easy assembly.
Features
鈥?Highest power density solution available when combined
with the PowerCode鈩?ISL6592 Digital Multiphase
Controller
鈥?Integrated P-channel high-side FET
鈥?Integrated high and low side drivers
鈥?30A per power stage capability
鈥?Discrete low-side FET for best efficiency
鈥?Process and temperature independent lossless integrated
current sense for accurate loadlines and overcurrent
protection
鈥?Integrated high-side short detection protects processor
from over-voltage due to any shorted high-side FET in the
system
鈥?High-side short detect can be used with optional external
SCR crowbar circuit to further protect the processor from
shorted high-side FETs
鈥?On-die temperature sense works in conjunction with the
ISL6592 Digital Multiphase Controller to provide accurate
programmable thermal shutdown protection
鈥?Low-side driver supply (VDRIVE) may be separately
biased from 5V to 12V to optimize efficiency
鈥?35-ball small form factor CSP package (3.185mm x
4.835mm) provides ultra low thermal resistance
Applications
鈥?Core power regulation for Intel
廬
and AMD
廬
processors
鈥?Small form factor point-of-load applications
Ordering Information
PART NUMBER
ISL6597
TEMP (擄C)
PACKAGE
35 BALL CSP
PKG.
DWG. #
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
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Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright 漏 Intersil Americas Inc. 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
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