鈥?/div>
N-Channel Application-Specific MOSFETs
Ideal for CPU Core DC-DC Converters
Low Conduction Losses
Low Switching Losses
Minimizes Parallel MOSFETs for high current
applications
PD - 93838
PD - 93839
HEXFET
廬
Chipset for DC-DC Converters
D
Description
These new devices employ advanced HEXFET
廬
power
MOSFET technology to achieve an unprecedented balance
of on-resistance and gate charge. The reduced conduction
and switching losses make them ideal for high efficiency
DC-DC converters that power the latest generation of
microprocessors.
Both the IRLR8103 and IRLR8503 have been optimized
and are 100% tested for all parameters that are critical in
synchronous buck converters including R
DS(on)
, gate charge
and Cdv/dt-induced turn-on immunity. The IRLR8103 offers
particulary low R
DS(on)
and high Cdv/dt immunity for
synchronous FET applications. The IRLR8503 offers an
extremely low combination of Q
sw
& R
DS(on)
for reduced
losses in control FET applications.
The package is designed for vapor phase, infrared,
convection, or wave soldering techniques. Power
dissipation of greater than 80W is possible in a typical PCB
mount application.
G
S
D-Pak
DEVICE RATINGS (typ.)
IRLR8103
V
DS
R
DS
(on)
Q
G
Q
sw
Q
oss
30V
6 m鈩?/div>
45 nC
20.3 nC
23 nC
IRLR8503
30V
12 m鈩?/div>
15 nC
5.4 nC
23 nC
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain or Source
Current (V
GS
鈮?/div>
10V)
Pulsed Drain Current聛
Power Dissipation
T
A
= 25擄C
T
L
= 90擄C
Junction & Storage Temperature Range
Continuous Source Current (Body Diode)
Pulsed Source Current聛
Thermal Resistance
Parameter
Maximum Junction-to-Ambient PCB聝
Maximum Junction-to-Case
R
胃JA
R
胃JC
Revised 1/13/00
Symbol
V
DS
V
GS
T
A
= 25擄C
T
L
= 90擄C
I
DM
P
D
T
J
, T
STG
I
S
I
SM
I
D
IRLR8103
30
鹵20
89聟
61聟
350
89
42
IRLR8503
Units
V
49聟
34聟
196
62
30
鈥?5 to 150
擄C
49聟
196
A
W
A
89聟
350
Max.
50
1.4
2.0
Units
擄C/W
擄C/W
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