PD - 91508D
IRLMS1503
HEXFET
廬
Power MOSFET
l
l
l
l
Generation V Technology
Micro6 Package Style
Ultra Low
R
DS(on)
N-Channel MOSFET
D
D
G
1
6
A
D
D
S
V
DSS
= 30V
2
5
3
4
Description
Fifth Generation HEXFET
廬
power MOSFETs from
International Rectifier utilize advanced processing
techniques to achieve extremely low on-resistance
per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that
HEXFET
廬
power MOSFETs are well known for,
provides the designer with an extremely efficient and
reliable device for use in a wide variety of applications.
The Micro6錚?package with its customized leadframe
produces a HEXFET
廬
power MOSFET with R
DS(on)
60% less than a similar size SOT-23. This package is
ideal for applications where printed circuit board space
is at a premium. It's unique thermal design and R
DS(on)
reduction enables a current-handling increase of
nearly 300% compared to the SOT-23.
R
DS(on)
= 0.10鈩?/div>
Top View
Micro6錚?/div>
Absolute Maximum Ratings
Parameter
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
P
D
@T
A
= 25擄C
V
GS
dv/dt
T
J,
T
STG
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
聛
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt
聜
Junction and Storage Temperature Range
Max.
3.2
2.6
18
1.7
13
鹵 20
5.0
-55 to + 150
Units
A
W
mW/擄C
V
V/ns
擄C
Thermal Resistance Ratings
R
胃JA
Maximum Junction-to-Ambient
聞
Parameter
Min.
聳聳聳
Typ.
聳聳聳
Max
75
Units
擄C/W
www.irf.com
1
3/17/04
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