= 60m鈩?/div>
G
S
I
D
= 5.0A
Description
Specifically designed for Automotive applications, this HEXFET
廬
Power MOSFET utilizes the latest processing techniques to
achieve extremely low on-resistance per silicon area. Additional
features of this design are a 150擄C junction operating tempera-
ture, fast switching speed and improved repetitive avalanche
rating . These features combine to make this design an ex-
tremely efficient and reliable device for use in Automotive
applications and a wide variety of other applications.
SOT-223
Absolute Maximum Ratings
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
P
D
@T
A
= 25擄C
P
D
@T
A
= 25擄C
V
GS
E
AS
(Tested )
I
AR
E
AR
T
J
T
STG
Continuous Drain Current, V
GS
@ 10V
(Silicon Limited)
i
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Parameter
Max.
5.0
4.0
40
2.8
1.0
0.02
鹵 16
Units
A
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
i
j
聶
i
i
d
h
W
W/擄C
V
mJ
A
mJ
E
AS (Thermally limited)
Single Pulse Avalanche Energy
Avalanche Current
21
38
See Fig.12a, 12b, 15, 16
-55 to + 150
Single Pulse Avalanche Energy Tested Value
脙聶
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
g
擄C
Thermal Resistance
R
胃JA
R
胃JA
i
Junction-to-Ambient (PCB mount, steady state)
j
Junction-to-Ambient (PCB mount, steady state)
Parameter
Typ.
鈥撯€撯€?/div>
鈥撯€撯€?/div>
Max.
45
120
Units
擄C/W
www.irf.com
1
08/03/04
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