50% greater current in typ.
application conditions vs. TO-220
= 0.004鈩?/div>
G
I
D
= 185A聟
S
Description
The HEXFET
廬
is the most popular power MOSFET in the world.
This particular HEXFET
廬
is in the Super220
TM
and has
the same outline and
pinout as the industry standard TO-220. It has increased current handling
capability over both the TO-220 and the much larger TO-247 package. This
makes it ideal to reduce component count in multiparalled TO-220 applications,
reduce system power dissipation, upgrade existing designs or have TO-247
performance in a TO-220 outline.
This package has also been designed to meet
automotive qualification standard Q101.
Super_ 220
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25擄C
I
D
@ T
C
= 100擄C
I
DM
P
D
@T
C
= 25擄C
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
聛
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy聜
Avalanche Current聛
Repetitive Avalanche Energy聛
Peak Diode Recovery dv/dt
聝
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Recommended clip force
Max.
185, pkg limited to 95A*
130, pkg limited to 95A*
740
300
2.0
鹵 16
1160
100
30
5.0
-55 to + 175
300 (1.6mm from case )
20
Units
A
W
W/擄C
V
mJ
A
mJ
V/ns
擄C
N
Thermal Resistance
Parameter
R
胃JC
R
胃CS
R
胃JA
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Typ.
鈥撯€撯€?/div>
0.5
鈥撯€撯€?/div>
Max.
0.5
鈥撯€撯€?/div>
58
Units
擄C/W
* Current capability in normal application, see Fig.9.
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