PD - 91731A
IRG4RC20F
INSULATED GATE BIPOLAR TRANSISTOR
Features
鈥?Fast: Optimized for medium operating
frequencies (1-5 kHz in hard switching, >20
kHz in resonant mode).
鈥?Generation 4 IGBT design provides tighter
parameter distribution and higher efficiency than
previous generation IGBTs.
鈥?Industry standard TO-252AA package
鈥?Combines very low V
CE(on)
with low switching
losses
C
Fast Speed IGBT
V
CES
= 600V
G
E
V
CE(on) typ.
= 1.82V
@V
GE
= 15V, I
C
= 12A
N-channel
Benefits
鈥?Generation 4 IGBTs offer highest efficiency
鈥?Optimized for specific application conditions
鈥?High power density and current rating
D-Pak
TO-252AA
Absolute Maximum Ratings
Parameter
V
CES
I
C
@ T
C
= 25擄C
I
C
@ T
C
= 100擄C
I
CM
I
LM
V
GE
E
ARV
P
D
@ T
C
= 25擄C
P
D
@ T
C
= 100擄C
T
J
T
STG
Collector-to-Emitter Breakdown Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current
聛
Clamped Inductive Load Current
聜
Gate-to-Emitter Voltage
Reverse Voltage Avalanche Energy
聝
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw.
Max.
600
22
12
44
44
鹵 20
5.0
66
26
-55 to + 150
300 (0.063 in. (1.6mm) from case )
10 lbf鈥n (1.1N鈥)
Units
V
A
V
mJ
W
擄C
Thermal Resistance
Parameter
R
胃JC
R
胃JA
Wt
Junction-to-Case
Junction-to-Ambient (PCB mount)*
Weight
Typ.
鈥撯€撯€?/div>
鈥撯€撯€?/div>
0.3 (0.01)
Max.
1.9
50
鈥撯€撯€?/div>
Units
擄C/W
g (oz)
* When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to application note #AN-994
2/22/01
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