IRG4RC10SD Datasheet

IC型號：
IRG4RC10SD
PDF描述：
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVE...
文件大?。?/label>
190.81KB
PDF頁數(shù)：
10頁
芯片廠家：
IRF

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IRG4RC10SD

INSULATED GATE BIPOLAR TRANSISTOR WITH

ULTRAFAST SOFT RECOVERY DIODE

Features

鈥?Extremely low voltage drop 1.1V(typ) @ 2A

鈥?S-Series: Minimizes power dissipation at up to 3

KHz PWM frequency in inverter drives, up to 4

KHz in brushless DC drives.

鈥?Tight parameter distribution

鈥?IGBT co-packaged with HEXFRED

ultrafast,

ultra-soft-recovery anti-parallel diodes for use

in bridge configurations

鈥?Industry standard TO-252AA package

Standard Speed CoPack

IGBT

CES

= 600V

CE(on) typ.

1.10V

= 15V, I

= 2.0A

n-ch an nel

Benefits

鈥?Generation 4 IGBT's offer highest efficiencies

available

鈥?IGBT's optimized for specific application conditions

鈥?HEXFRED diodes optimized for performance with

IGBT's . Minimized recovery characteristics require

less/no snubbing

鈥?Lower losses than MOSFET's conduction and

Diode losses

D-PAK

TO-252AA

Absolute Maximum Ratings

Parameter

CES

@ T

= 25擄C

@ T

= 100擄C

@ T

= 100擄C

@ T

= 25擄C

@ T

= 100擄C

STG

Collector-to-Emitter Voltage

Continuous Collector Current

Pulsed Collector CurrentQ

Clamped Inductive Load Current

Diode Continuous Forward Current

Diode Maximum Forward Current

Gate-to-Emitter Voltage

Maximum Power Dissipation

Operating Junction and

Storage Temperature Range

Max.

600

8.0

4.0

鹵 20

-55 to +150

Units

擄C

Thermal Resistance

Parameter

胃JC

胃JA

Junction-to-Case - IGBT

Junction-to-Case - Diode

Junction-to-Ambient (PCB mount)*

Weight

Typ.

鈥撯€撯€?/div>

0.3 (0.01)

Max.

3.3

7.0

鈥撯€撯€?/div>

Units

擄C/W

g (oz)

* When mounted on 1" square PCB (FR-4 or G-10 Material).

For recommended footprint and soldering techniques refer to application note #AN-994

www.irf.com

12/30/00

標(biāo)準(zhǔn)包裝
75
類別
分離式半導(dǎo)體產(chǎn)品
家庭
IGBT - 單路
系列
-
IGBT 類型
-
電壓 - 集電極發(fā)射極擊穿（最大）
600V
Vge, Ic時的最大Vce（開）
1.8V @ 15V，8A
電流 - 集電極 (Ic)（最大）
14A
功率 - 最大
38W
輸入類型
標(biāo)準(zhǔn)型
安裝類型
表面貼裝
封裝/外殼
TO-252-3，DPak（2 引線+接片），SC-63
供應(yīng)商設(shè)備封裝
D-Pak
包裝
管件
其它名稱
*IRG4RC10SD

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