PD - 94440
IRG4PC60F-P
INSULATED GATE BIPOLAR TRANSISTOR
C
Fast Speed IGBT
V
CES
= 600V
Features
鈥?Fast: Optimized for medium operating
frequencies ( 1-5 kHz in hard switching, >20
kHz in resonant mode).
鈥?Generation 4 IGBT design provides tighter
parameter distribution and higher efficiency.
鈥?Solder plated version of industry standard
TO-247AC package.
G
E
V
CE(on)
typ.
=
1.50V
@V
GE
= 15V, I
C
= 60A
n-channel
Benefits
鈥?Generation 4 IGBT's offer highest efficiency available.
鈥?IGBT's optimized for specified application conditions.
鈥?Solder plated version of the TO-247 allows the reflow
soldering of the package heatsink to a substrate material.
鈥?Designed for best performance when used with IR
HEXFRED & IR FRED companion diodes.
TO-247AC
Absolute Maximum Ratings
Parameter
V
CES
I
C
@ T
C
= 25擄C
I
C
@ T
C
= 100擄C
I
CM
I
LM
V
GE
E
ARV
P
D
@ T
C
= 25擄C
P
D
@ T
C
= 100擄C
T
J
T
STG
Collector-to-Emitter Breakdown Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current
Q
Clamped Inductive Load Current
R
Gate-to-Emitter Voltage
Reverse Voltage Avalanche Energy
S
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw
Maximum Reflow Temperature
W
Max.
600
90
60
120
120
鹵 20
200
520
210
-55 to + 150
300 (0.063 in. (1.6mm from case )
10 lbf鈥n (1.1N鈥)
230 (Time above 183擄C
should not exceed 100s)
Units
V
A
V
mJ
W
擄C
擄C
Thermal Resistance
Parameter
R
胃JC
R
胃CS
R
胃JA
R
胃JA
Wt
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient (Typical Socket Mount)
Junction-to-Ambient (PCB Mount, Steady State)
V
Weight
Typ.
鈥撯€撯€?/div>
0.24
鈥撯€撯€?/div>
鈥撯€撯€?/div>
6 (0.21)
Max.
0.24
鈥撯€撯€?/div>
40
20
鈥撯€撯€?/div>
Units
擄C/W
g (oz)
www.irf.com
1
04/26/02
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