PD- 91834A
IRG4CC71KB
IRG4CC71KB IGBT Die in Wafer Form
C
600 V
Size 7.1
Ultra-Fast Speed
Circuit Rated Rated
G
E
6" Wafer
Electrical Characteristics ( Wafer Form )
Parameter
V
CE (on)
V
(BR)CES
V
GE(th)
I
CES
I
GES
Description
Collector-to-Emitter Saturation Voltage
Colletor-to-Emitter Breakdown Voltage
Gate Threshold Voltage
Zero Gate Voltage Collector Current
Gate-to-Emitter Leakage Current
Guaranteed (Min/Max)
1.7V Max.
600V Min.
3.0V Min., 6.5V Max.
300 碌A(chǔ) Max.
鹵 1.1 碌A(chǔ) Max.
Test Conditions
I
C
= 10A, T
J
= 25擄C, V
GE
= 15V
T
J
= 25擄C, I
CES
= 250碌A(chǔ), V
GE
= 0V
V
GE
= V
CE
, T
J
=25擄C, I
C
=250碌A(chǔ)
T
J
= 25擄C, V
CE
= 600V
T
J
= 25擄C, V
GE
= +/- 20V
Mechanical Data
Nominal Backmetal Composition, Thickness:
Nominal Front Metal Composition, Thickness:
Dimensions:
Wafer Diameter:
Wafer thickness:
Relevant Die Mechanical Dwg. Number01-5271
Minimum Street Width
Reject Ink Dot Size
Ink Dot Location
Recommended Storage Environment:
Recommended Die Attach Conditions
Reference Standard IR packaged part ( for design ) : IRG4PSC71K
Cr-NiV-Ag ( 1kA-2kA-.2.5kA )
99% Al, 1% Si (4 microns)
0.305" x 0.390"
150mm, with std. < 100 > flat
.015" + / -.003"
100 Microns
0.25mm Diameter Minimum
Consistent throughout same wafer lot
Store in original container, in dessicated
nitrogen, with no contamination
For optimum electrical results, die attach
temperature should not exceed 300C
Die Outline
www.irf.com
11/28/05
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