PD-94011A
SMPS MOSFET
Applications
l
SMPS, UPS, Welding and High Speed
V
DSS
Power Switching
500V
Benefits
l
Dynamic dv/dt Rating
l
Repetitive Avalanche Rated
l
Isolated Central Mounting Hole
l
Fast Switching
l
Ease of Paralleling
l
Simple Drive Requirements
l
Solder plated and leadformed for surface mounting
Description
Third Generation HEXFET
廬
s from International Rectifier provide the
designer with the best combination of fast switching, ruggedized
device design, low on-resistance and cost-effectiveness.
The TO-247 package is preferred for commercial-industrial
applications where higher power levels preclude the use of TO-220
devices. The TO-247 is similar but superior to the earlier TO-218
package because of its isolated mounting hole. It also provides
greater creepage distance between pins to meet the requirements of
most safety specifications.
This plated and leadformed version of the TO-247 package allows
the package to be surface mounted in an application.
IRFP460AS
HEXFET
廬
Power MOSFET
Rds(on) max
0.27鈩?/div>
I
D
20A
SMD-247
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25擄C
I
D
@ T
C
= 100擄C
I
DM
P
D
@T
C
= 25擄C
V
GS
dv/dt
T
J
T
STG
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
聛
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt
聝
Operating Junction and
Storage Temperature Range
Mounting torqe, 6-32 or M3 screw
Maximum Reflow Temperature
Max.
20
13
80
280
2.2
鹵 30
3.8
-55 to + 150
10 lbf鈥n (1.1N鈥)
230 (Time above 183 擄C
should not exceed 100s)
Units
A
W
W/擄C
V
V/ns
擄C
擄C
Typical SMPS Topologies:
l
Full Bridge
l
PFC Boost
www.irf.com
Notes
聛
through
聟
are on page 8
1
01/17/01
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