PD - 96966A
PDP MOSFET
Features
l
Advanced process technology
l
Key parameters optimized for PDP Sustain &
Energy Recovery applications
l
Low E
PULSE
rating to reduce the power
dissipation in Sustain & ER applications
l
Low Q
G
for fast response
l
High repetitive peak current capability for
reliable operation
l
Short fall & rise times for fast switching
l
175擄C operating junction temperature for
improved ruggedness
l
Repetitive avalanche capability for robustness
and reliability
IRFP4242PbF
Key Parameters
300
360
49
93
175
D
D
V
DS
min
V
DS (Avalanche)
typ.
R
DS(ON)
typ. @ 10V
I
RP
max @ T
C
= 100擄C
T
J
max
V
V
m:
A
擄C
G
S
G
D
S
TO-247AC
D
S
G
G a te
D ra in
S o u rc e
Description
This
HEXFET
廬
Power MOSFET
is specifically designed for Sustain; Energy Recovery & Pass switch
applications in Plasma Display Panels. This
MOSFET
utilizes the latest processing techniques to achieve
low on-resistance per silicon area and low E
PULSE
rating. Additional features of this
MOSFET
are 175擄C
operating junction temperature and high repetitive peak current capability. These features combine to
make this
MOSFET
a highly efficient, robust and reliable device for PDP driving applications.
Absolute Maximum Ratings
Parameter
V
GS
I
D
@ T
C
= 25擄C
I
D
@ T
C
= 100擄C
I
DM
I
RP
@ T
C
= 100擄C
P
D
@T
C
= 25擄C
P
D
@T
C
= 100擄C
T
J
T
STG
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Soldering Temperature for 10 seconds
Mounting Torque, 6-32 or M3 Screw
10lb in (1.1N m)
Max.
鹵30
46
33
190
93
430
210
2.9
-40 to + 175
300
Units
V
A
c
Repetitive Peak Current
g
W
W/擄C
擄C
x
x
N
Thermal Resistance
R
胃JC
Junction-to-Case
f
Parameter
Typ.
鈥撯€撯€?/div>
Max.
0.35
Units
擄C/W
Notes
聛
through
聟
are on page 8
www.irf.com
1
7/25/05
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