= 5.3m鈩?/div>
I
D
= 95A
Description
Specifically designed for Automotive applications, this HEXFET
廬
Power MOSFET utilizes the latest processing techniques to
achieve extremely low on-resistance per silicon area. Additional
features of this design are a 175擄C junction operating tempera-
ture, fast switching speed and improved repetitive avalanche
rating . These features combine to make this design an extremely
efficient and reliable device for use in Automotive applications and
a wide variety of other applications.
D
G
TO-247AC
S
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25擄C
I
D
@ T
C
= 100擄C
I
D
@ T
C
= 25擄C
I
DM
P
D
@T
C
= 25擄C
V
GS
E
AS (Thermally limited)
E
AS
(Tested )
I
AR
E
AR
T
J
T
STG
Continuous Drain Current, V
GS
@ 10V
(Silicon Limited)
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
(Package Limited)
Pulsed Drain Current
Max.
160
110
95
640
310
2.0
鹵 20
530
1060
See Fig.12a, 12b, 15, 16
-55 to + 175
Units
A
聶
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
W
W/擄C
V
mJ
A
mJ
擄C
d
脙聶
h
g
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
300 (1.6mm from case )
10 lbf in (1.1N m)
Thermal Resistance
Parameter
R
胃JC
R
胃cs
R
胃JA
Junction-to-Case *
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient *
y
y
Typ.
鈥撯€撯€?/div>
0.24
鈥撯€撯€?/div>
Max.
0.49
鈥撯€撯€?/div>
40
Units
擄C/W
HEXFET
廬
is a registered trademark of International Rectifier.
*
R
胃
is measured at T
J
approximately 90擄C
www.irf.com
1
12/22/03
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