= 57.5m鈩?/div>
I
D
= 5.1A
Description
Specifically designed for Automotive applications, this
HEXFET
廬
Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per
silicon area. Additional features of this design are a
150擄C junction operating temperature, fast switching
speed and improved repetitive avalanche rating . These
features combine to make this design an extremely
efficient and reliable device for use in Automotive applica-
tions and a wide variety of other applications.
SOT-223
Absolute Maximum Ratings
Parameter
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
Continuous Drain Current, V
GS
@ 10V
(Silicon Limited)
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Max.
5.1
4.1
41
2.8
1.0
0.02
鹵 20
13
32
See Fig.12a, 12b, 15, 16
-55 to + 150
Units
A
P
D
@T
A
= 25擄C Power Dissipation
P
D
@T
A
= 25擄C Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
V
GS
E
AS (Thermally limited)
Single Pulse Avalanche Energy
E
AS
(Tested )
I
AR
E
AR
T
J
T
STG
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
W
W/擄C
V
mJ
A
mJ
擄C
Thermal Resistance
Parameter
R
胃JA
R
胃JA
Junction-to-Ambient (PCB mount, steady state)
Junction-to-Ambient (PCB mount, steady state)
Typ.
鈥撯€撯€?/div>
鈥撯€撯€?/div>
Max.
45
120
Units
擄C/W
www.irf.com
1
05/25/04
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