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IRFL024ZPBF Datasheet

  • IRFL024ZPBF

  • HEXFET Power MOSFET

  • 192.07KB

  • 10頁(yè)

  • IRF

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PD - 95250
AUTOMOTIVE MOSFET
Features
Advanced Process Technology
Ultra Low On-Resistance
150擄C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
IRFL024ZPbF
HEXFET
Power MOSFET
D
V
DSS
= 55V
G
S
R
DS(on)
= 57.5m鈩?/div>
I
D
= 5.1A
Description
Specifically designed for Automotive applications, this
HEXFET
Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per
silicon area. Additional features of this design are a
150擄C junction operating temperature, fast switching
speed and improved repetitive avalanche rating . These
features combine to make this design an extremely
efficient and reliable device for use in Automotive applica-
tions and a wide variety of other applications.
SOT-223
Absolute Maximum Ratings
Parameter
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
Continuous Drain Current, V
GS
@ 10V
(Silicon Limited)
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Max.
5.1
4.1
41
2.8
1.0
0.02
鹵 20
13
32
See Fig.12a, 12b, 15, 16
-55 to + 150
Units
A
P
D
@T
A
= 25擄C Power Dissipation
P
D
@T
A
= 25擄C Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
V
GS
E
AS (Thermally limited)
Single Pulse Avalanche Energy
E
AS
(Tested )
I
AR
E
AR
T
J
T
STG
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
W
W/擄C
V
mJ
A
mJ
擄C
Thermal Resistance
Parameter
R
胃JA
R
胃JA
Junction-to-Ambient (PCB mount, steady state)
Junction-to-Ambient (PCB mount, steady state)
Typ.
鈥撯€撯€?/div>
鈥撯€撯€?/div>
Max.
45
120
Units
擄C/W
www.irf.com
1
05/25/04

IRFL024ZPBF 產(chǎn)品屬性

  • 2,560

  • 分離式半導(dǎo)體產(chǎn)品

  • FET - 單

  • HEXFET®

  • MOSFET N 通道,金屬氧化物

  • 邏輯電平門

  • 55V

  • 5.1A

  • 57.5 毫歐 @ 3.1A,10V

  • 4V @ 250µA

  • 14nC @ 10V

  • 340pF @ 25V

  • 1W

  • 表面貼裝

  • TO-261-4,TO-261AA

  • SOT-223

  • 管件

  • *IRFL024ZPBF

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