= 3.0鈩?/div>
G
I
D
= -2.0A
S
Description
Third Generation HEXFETs from International Rectifier provide the designer with the
best combination of fast switching, ruggedized device design, low on-resistance and
cost-effectiveness.Third Generation HEXFETs from International Rectifier provide the
designer with the best combination of fast switching, ruggedized device design, low
on-resistance and cost-effectiveness.
The TO-220 Fullpak eliminates the need for additional insulating hardware in commercial-
industrial applications. The moulding compound used provides a high isolation capability
and a low thermal resistance between the tab and external heatsink. This isolation is
equivalent to using a 100 micron mica barrier with standard TO-220 product. The Fullpak
is mounted to a heatsink using a single clip or by a single screw fixing.
TO-220 Full-Pak
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25擄C
I
D
@ T
C
= 100擄C
I
DM
P
D
@T
C
= 25擄C
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
Continuous Drain Current, V
GS
@ -10V
Continuous Drain Current, V
GS
@ -10V
Pulsed Drain Current
聛
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy聜
Avalanche Current聛
Repetitive Avalanche Energy聛
Peak Diode Recovery dv/dt
聝
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw
Max.
-2.0
-1.3
-8.0
27
0.22
鹵 20
100
-2.0
2.7
-11
-55 to + 150
300 (1.6mm from case )
10 lbf聲in (1.1N聲m)
Units
A
W
W/擄C
V
mJ
A
mJ
V/ns
擄C
Thermal Resistance
Parameter
R
胃JC
R
胃JA
Junction-to-Case
Junction-to-Ambient
Typ.
聳聳聳
聳聳聳
Max.
4.6
65
Units
擄C/W
07/06/04