鈩?/div>
family of Co-Pack HEXFET
廬
MOSFETs and Schottky diodes offers the designer an innovative,
board space saving solution for switching regulator and power management applications. Advanced
HEXFET
廬
MOSFETs combined with low forward drop Schottky results in an extremely efficient device suitable
for a wide variety of portable electronics applications.
The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple
die capability making it ideal in a variety of power applications. With these improvements, multiple devices can
be used in an application with dramatically reduced board space. Internal connections enable easier board
layout design with reduced stray inductance.
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Output
Current (V
GS
鈮?/div>
4.5V)聞
Pulsed Drain Current聛
Power Dissipation聝
Pulsed Source Current
聛
Thermal Resistance
Parameter
Maximum Junction-to-Ambient聝
Maximum Junction-to-Lead聟
R
胃JA
R
胃JL
Max.
62.5
25
Units
擄C/W
擄C/W
T
L
= 100擄C
Junction & Storage Temperature Range
I
DM
P
D
T
J
, T
STG
I
SM
24
2.0
鈥?5 to 150
12
W
擄C
A
T
L
= 100擄C
Symbol
V
DS
V
GS
I
D
IRF7901D1
30
鹵20
6.2
A
Units
V
www.irf.com
1
9/19/01
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