鈥?/div>
N-Channel Application-Specific MOSFETs
HEXFET
廬
Chipset for DC-DC Converters
S
S
S
G
1
8
7
鈥?Ideal for CPU Core DC-DC Converters
鈥?New
CopperStrap
TM
Interconnect for Lower
Electrical and Thermal Resistance
鈥?Low Conduction Losses
鈥?Low Switching Losses
鈥?Minimizes Parallel MOSFETs for high
current applications
Description
These new devices employ advanced HEXFET
廬
Power
MOSFET technology to achieve an unprecedented
balance of on-resistance and gate charge. The reduced
conduction and switching losses make them ideal for
high efficiency DC-DC converters that power the latest
generation of mobile microprocessors.
The IRF7809/IRF7811 employs a new
CopperStrap
TM
interconnect technology pioneered by International
Rectifier to dramatically improve the electrial & thermal
resistance contribution of the package. The new
CopperStrap
SO-8 power MOSFETs are capable of
current ratings over 17A and power dissipation of 3.5W
@ 25擄C ambient conditions, thereby reducing the need
for paralleled devices, improving efficiency and
reliability and reducing board space.
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain or Source
Current (V
GS
鈮?/div>
4.5V)
Pulsed Drain Current聛
Power Dissipation
T
A
= 25擄C
T
L
= 90擄C
Junction & Storage Temperature Range
Continuous Source Current (Body Diode)
Pulsed Source Current聛
Thermal Resistance
Parameter
Maximum Junction-to-Ambient聝
Maximum Junction-to-Lead
R
胃JA
R
胃JL
Max.
35
20
T
J
, T
STG
I
S
I
SM
2.5
50
T
A
= 25擄C
T
L
= 90擄C
I
DM
P
D
Symbol
V
DS
V
GS
I
D
17.6
16.3
100
3.5
3.0
鈥?5 to 150
IRF7809
30
鹵12
A
A
D
D
D
D
2
3
6
4
5
SO-8
T o p V ie w
DEVICE RATINGS
IRF7809
V
DS
R
DS
(on)
Q
G
Q
sw
Q
oss
30V
7.5 m鈩?/div>
77.5 nC
23.9 nC
30 nC
IRF7811
28V
11 m鈩?/div>
23 nC
7 nC
31 nC
IRF7811
28
14
13
100
Units
V
A
W
擄C
2.5
50
A
Units
擄C/W
擄C/W
www.irf.com
1
1/19/00
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