鈩?/div>
family of Co-Pack HEXFET
廬
MOSFETs
and Schottky diodes offers the designer an innovative,
board space saving solution for switching regulator and
power management applications. HEXFET power
MOSFETs utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area.
Combining this technology with International Rectifier鈥檚
low forward drop Schottky rectifiers results in an extremely
efficient device suitable for use in a wide variety of
portable electronics applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics. The SO-
8 package is designed for vapor phase, infrared or wave
soldering techniques.
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain or Source
Current (V
GS
鈮?/div>
4.5V)
Pulsed Drain Current聛
Power Dissipation
Schottky and Body Diode
Average ForwardCurrent聞
25擄C
70擄C
25擄C
70擄C
T
J
, T
STG
I
F
(AV)
25擄C
70擄C
I
DM
P
D
Symbol
V
DS
V
GS
I
D
Max.
30
鹵12
8.3
6.6
66
2.5
1.6
3.7
2.3
鈥?5 to 150
Top View
Device Features (Max Values)
IRF7807D2
V
DS
R
DS
(on)
Q
g
Q
SW
Q
oss
30V
25m鈩?/div>
14nC
5.2nC
21.6nC
Units
V
A
W
A
擄C
Junction & Storage Temperature Range
Thermal Resistance
Parameter
Maximum Junction-to-Ambient聝
R
胃JA
Max.
50
Units
擄C/W
www.irf.com
1
10/7/04
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