鈩?/div>
family of Co-Pack HEXFET
廬
MOSFETs and
Schottky diodes offers the designer an innovative, board
space saving solution for switching regulator and power
management applications. HEXFET power MOSFETs
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. Combining
this technology with International Rectifier鈥檚 low forward
drop Schottky rectifiers results in an extremely efficient
device suitable for use in a wide variety of portable
electronics applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics. The SO-
8 package is designed for vapor phase, infrared or wave
soldering techniques.
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain or Source
Current (V
GS
鈮?/div>
4.5V)
Pulsed Drain Current聛
Power Dissipation
Schottky and Body Diode
Average ForwardCurrent聞
25擄C
70擄C
25擄C
70擄C
T
J
, T
STG
I
F
(AV)
25擄C
70擄C
I
DM
P
D
Symbol
V
DS
V
GS
I
D
Max.
30
鹵12
8.3
6.6
66
2.5
1.6
3.5
2.2
鈥?5 to 150
擄C
W
A
A
Units
V
A/S
A/S
A/S
G
1
8
K/D
K/D
K/D
K/D
D
2
7
3
6
4
5
SO-8
Top View
Device Features (Max Values)
IRF7807D1
V
DS
R
DS(on)
Q
g
Q
sw
Q
oss
30V
25m鈩?/div>
14nC
5.2nC
18.4nC
Junction & Storage Temperature Range
Thermal Resistance
Parameter
Maximum Junction-to-Ambient聝
R
胃JA
Max.
50
Units
擄C/W
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