PD - 93849C
PROVISIONAL
IRF7702
HEXFET
廬
Power MOSFET
R
DS(on)
max
0.014@V
GS
= -4.5V
0.019@V
GS
= -2.5V
0.027@V
GS
= -1.8V
l
l
l
l
l
l
Ultra Low On-Resistance
-1.8V Rated
P-Channel MOSFET
Very Small SOIC Package
Low Profile ( < 1.1mm)
Available in Tape & Reel
V
DSS
-12V
I
D
-8.0A
-7.0A
-5.8A
1
D
8
7
Description
HEXFET
廬
Power MOSFETs from International Rectifier
utilize advanced processing techniques to achieve ex-
tremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design, that Inter-
national Rectifier is well known for,
provides thedesigner
2
3
4
1=
2=
3=
4=
D
S
S
G
G
6
S
8=
7=
6=
5=
D
S
S
D
5
with an extremely efficient and reliable device for
battery and load management.
The TSSOP-8 package has 45% less footprint area than
the standard SO-8. This makes the TSSOP-8 an ideal
device for applications where printed circuit board space
is at a premium. The low profile (<1.1mm) allows it to fit
easily into extremely thin environments such as portable
electronics and PCMCIA cards.
TSSOP-8
Absolute Maximum Ratings
Parameter
V
DS
I
D
@ T
C
= 25擄C
I
D
@ T
C
= 70擄C
I
DM
P
D
@T
C
= 25擄C
P
D
@T
C
= 70擄C
V
GS
T
J,
T
STG
Drain- Source Voltage
Continuous Drain Current, V
GS
@ -4.5V
Continuous Drain Current, V
GS
@ -4.5V
Pulsed Drain Current
聛
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
Max.
-12
鹵8.0
鹵7.0
鹵70
1.5
0.96
0.01
鹵 8.0
-55 to + 150
Units
V
A
W
W/擄C
V
擄C
Thermal Resistance
Parameter
R
胃JA
Maximum Junction-to-Ambient
聝
Max.
83
Units
擄C/W
www.irf.com
1
6/19/00