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IRF7701 Datasheet

  • IRF7701

  • Power MOSFET(Vdss=-12V)

  • 9頁(yè)

  • IRF

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PD - 93940
IRF7701
HEXFET
Power MOSFET
l
l
l
l
l
Ultra Low On-Resistance
P-Channel MOSFET
Very Small SOIC Package
Low Profile (< 1.1mm)
Available in Tape & Reel
V
DSS
-12V
R
DS(on)
max
0.011@V
GS
= -4.5V
0.015@V
GS
= -2.5V
0.022@V
GS
= -1.8V
I
D
-10A
-8.5A
-7.0A
Description
HEXFET
power MOSFETs from International Rectifier
utilize advanced processing techniques to achieve ex-
tremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design , that Inter-
national Rectifier is well known for,
provides thedesigner
1
2
3
4
1=
2=
3=
4=
D
S
S
G
D
8
7
G
6
S
8=
7=
6=
5=
D
S
S
D
5
with an extremely efficient and reliable device for use
in battery and load management.
The TSSOP-8 package, has 45% less footprint area of the
standard SO-8. This makes the TSSOP-8 an ideal device
for applications where printed circuit board space is at a
premium.
The low profile (<1.1mm) of the TSSOP-8 will allow it to fit
easily into extremely thin application environments such
as portable electronics and PCMCIA cards.
TSSOP-8
Absolute Maximum Ratings
Parameter
V
DS
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
P
D
@T
A
= 25擄C
P
D
@T
A
= 70擄C
V
GS
T
J,
T
STG
Drain- Source Voltage
Continuous Drain Current, V
GS
@ -4.5V
Continuous Drain Current, V
GS
@ -4.5V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
Max.
-12
鹵10
鹵8.0
鹵80
1.5
0.96
12
鹵 8.0
-55 to + 150
Units
V
A
W
mW/擄C
V
擄C
Thermal Resistance
Parameter
R
胃JA
Maximum Junction-to-Ambient
Max.
83
Units
擄C/W
www.irf.com
1
6/21/00

IRF7701 產(chǎn)品屬性

  • 100

  • 分離式半導(dǎo)體產(chǎn)品

  • FET - 單

  • HEXFET®

  • MOSFET P 通道,金屬氧化物

  • 邏輯電平門

  • 12V

  • 10A

  • 11 毫歐 @ 10A,4.5V

  • 1.2V @ 250µA

  • 100nC @ 4.5V

  • 5050pF @ 10V

  • 1.5W

  • 表面貼裝

  • 8-TSSOP(0.173",4.40mm 寬)

  • 8-TSSOP

  • 管件

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