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IRF7555PBF Datasheet

  • IRF7555PBF

  • HEXFET㈢ Power MOSFET

  • 9頁

  • IRF

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PD -95993
IRF7555PbF
Trench Technology
l
Ultra Low On-Resistance
l
Dual P-Channel MOSFET
l
Very Small SOIC Package
l
Low Profile (<1.1mm)
l
Available in Tape & Reel
l
Lead-Free
l
HEXFET
Power MOSFET
S1
G1
S2
G2
1
8
D1
D1
D2
D2
2
7
V
DSS
= -20V
3
6
4
5
R
DS(on)
= 0.055鈩?/div>
Top View
Description
New trench HEXFET
power MOSFETs from International
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design that HEXFET
Power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a wide
variety of applications.
The new Micro8鈩?package has half the footprint area of the
standard SO-8. This makes the Micro8 an ideal package for
applications where printed circuit board space is at a premium.
The low profile (<1.1mm) of the Micro8 will allow it to fit easily
into extremely thin application environments such as portable
electronics and PCMCIA cards.
Micro8鈩?/div>
Absolute Maximum Ratings
Parameter
V
DS
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
P
D
@T
A
= 25擄C
P
D
@T
A
= 70擄C
V
GS
E
AS
dv/dt
T
J
, T
STG
Drain-Source Voltage
Continuous Drain Current, V
GS
@ -4.5V
Continuous Drain Current, V
GS
@ -4.5V
Pulsed Drain Current
Maximum Power Dissipation
Maximum Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy聞
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
Soldering Temperature, for 10 seconds
Max.
-20
-4.3
-3.4
-34
1.25
0.8
10
鹵 12
36
1.1
-55 to + 150
240 (1.6mm from case)
Units
V
A
W
W
mW/擄C
V
mJ
V/ns
擄C
Thermal Resistance
Parameter
R
胃JA
Max.
Maximum Junction-to-Ambient
Units
100
擄C/W
www.irf.com
1
2/22/05

IRF7555PBF相關(guān)型號PDF文件下載

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