= 0.135鈩?/div>
T o p V ie w
Description
Fifth Generation HEXFETs from International Rectifier utilize advanced
processing techniques to achieve extremely low on-resistance per silicon
area. This benefit, combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well known for, provides the
designer with an extremely efficient and reliable device for use in a wide variety
of applications.
The new Micro8 package, with half the footprint area of the standard SO-8,
provides the smallest footprint available in an SOIC outline. This makes the
Micro8 an ideal device for applications where printed circuit board space is
at a premium. The low profile (<1.1mm) of the Micro8 will allow it to fit easily
into extremely thin application environments such as portable electronics and
PCMCIA cards.
M icro 8
Absolute Maximum Ratings
Parameter
V
DS
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
P
D
@T
A
= 25擄C
P
D
@T
A
= 70擄C
V
GSM
V
GS
dv/dt
TJ , TSTG
Drain-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
聛
Maximum Power Dissipation聞
Maximum Power Dissipation
聞
Linear Derating Factor
Gate-to-Source Voltage Single Pulse tp<10碌s
Gate-to-Source Voltage
Peak Diode Recovery dv/dt
聜
Operating Junction and Storage Temperature Range
Soldering Temperature, for 10 seconds
Max.
20
2.4
1.9
19
1.25
0.8
0.01
16
鹵 12
5.0
-55 to + 150
240 (1.6mm from case)
Units
V
A
W
W
W/擄C
V
V
V/ns
擄C
Thermal Resistance
Parameter
R
胃JA
Maximum Junction-to-Ambient
聞
Max.
100
Units
擄C/W
All Micro8 Data Sheets reflect improved Thermal Resistance, Power and Current -Handling Ratings- effective
only for product marked with Date Code 505 or later .
www.irf.com
1
4/30/98