0.050鈩?0.105鈩?/div>
Description
Specifically designed for Automotive applications, these
HEXFET
廬
Power MOSFET's in a Dual SO-8 package utilize
the lastest processing techniques to achieve extremely low
on-resistance per silicon area. Additional features of these
Automotive qualified HEXFET Power MOSFET's are a
150擄C junction operating temperature, fast switching
speed and improved repetitive avalanche rating. These
benefits combine to make this design an extremely efficient
and reliable device for use in Automotive applications and
a wide variety of other applications.
The efficient SO-8 package provides enhanced thermal
characteristics and dual MOSFET die capability making it
ideal in a variety of power applications. This dual, surface
mount SO-8 can dramatically reduce board space and is
also available
in Tape & Reel.
SO-8
Absolute Maximum Ratings
Parameter
V
DS
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
P
D
@T
A
= 25擄C
P
D
@T
A
= 70擄C
E
AS
I
AR
E
AR
V
GS
dv/dt
T
J,
T
STG
Drain-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
聛
Maximum Power Dissipation
聟
Maximum Power Dissipation
聟
Single Pulse Avalanche Energy聝
Avalanche Current
Repetitive Avalanche Energy
Gate-to-Source Voltage
Peak Diode Recovery dv/dt
聜
Junction and Storage Temperature Range
Max.
N-Channel
55
4.7
3.8
38
2.0
1.3
72
4.7
0.20
鹵 20
5.0
-55 to + 150
-5.0
114
-3.4
P-Channel
-55
-3.4
-2.7
-27
Units
V
A
W
W
mJ
A
mJ
V
V/ns
擄C
Thermal Resistance
R
胃JA
Maximum Junction-to-Ambient
聟
Parameter
Typ.
聳聳聳
Max.
62.5
Units
擄C/W
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1
07/23/07