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Advanced Process Technology
Dual N-Channel MOSFET
Ultra Low On-Resistance
175擄C Operating Temperature
Repetitive Avalanche Allowed up to Tjmax
Automotive [Q101] Qualified
S1
G1
S2
G2
1
Description
Specifically designed for Automotive applications, these
HEXFET 廬 Power MOSFET鈥檚 in a Dual SO-8 package utilize
the lastest processing techniques to achieve extremely low
on-resistance per silicon area. Additional features of these
Automotive qualified HEXFET Power MOSFET鈥檚 are a 175擄C
junction operating temperature, fast switching speed and
improved repetitive avalanche rating. These benefits com-
bine to make this design an extremely efficient and reliable
device for use in Automotive applications and a wide variety
of other applications.
The 175擄C rating for the SO-8 package provides improved
thermal performance with increased safe operating area and
dual MOSFET die capability make it ideal in a variety of
power applications. This dual, surface mount SO-8 can
dramatically reduce board space and is also available in
Tape & Reel.
8
D1
D1
D2
D2
2
7
3
6
4
5
Top V ie w
SO-8
Absolute Maximum Ratings
Parameter
V
DS
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
P
D
@T
A
= 25擄C
P
D
@T
A
= 70擄C
V
GS
E
AS
I
AR
E
AR
T
J
, T
STG
Drain-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Q
Maximum Power Dissipation
S
Maximum Power Dissipation
S
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche EnergyR
Avalanche CurrentQ
Repetitive Avalanche Energy
Junction and Storage Temperature Range
Max.
55
5.1
4.2
42
2.4
1.7
16
鹵 20
140
5.1
See Fig. 14, 15, 16
-55 to + 175
Units
V
A
W
W
mW/擄C
V
mJ
A
mJ
擄C
Thermal Resistance
R
胃JA
Max.
Maximum Junction-to-Ambient
S
Parameter
Units
62.5
擄C/W
www.irf.com
1
03/14/02