PD - 95842
IRF6612/IRF6612TR1
V
DSS
l
HEXFET
廬
Power MOSFET
R
DS(on)
max
3.3m鈩V
GS
= 10V
4.4m鈩V
GS
= 4.5V
Qg(typ.)
30nC
Application Specific MOSFETs
l
Ideal for CPU Core DC-DC Converters
l
Low Conduction Losses
l
Low Switching Losses
l
Low Profile (<0.7 mm)
l
Dual Sided Cooling Compatible
l
Compatible with existing Surface Mount
Techniques
30V
MX
Applicable DirectFET Package/Layout Pad (see p.8,9 for details)
SQ
SX
ST
MQ
MX
MT
DirectFET聶 ISOMETRIC
Description
The IRF6612 combines the latest HEXFET廬 Power MOSFET Silicon technology with the advanced DirectFET
TM
packaging to achieve the
lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with
existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering tech-
niques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows
dual sided cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.
The IRF6612 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switch-
ing losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of
processors operating at higher frequencies. The IRF6612 has been optimized for parameters that are critical in synchronous buck convert-
ers including Rds(on), gate charge and Cdv/dt-induced turn on immunity to minimize losses in the synchronous FET socke
t.
Absolute Maximum Ratings
Parameter
V
DS
V
GS
I
D
@ T
C
= 25擄C
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
P
D
@T
A
= 25擄C
P
D
@T
A
= 70擄C
P
D
@T
C
= 25擄C
T
J
T
STG
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Power Dissipation
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Max.
30
鹵20
136
24
19
190
2.8
1.8
89
0.022
-40 to + 150
Units
V
A
g
g
c
W
W/擄C
擄C
Thermal Resistance
Parameter
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
R
胃JA
R
胃JA
R
胃JA
R
胃JC
R
胃J-PCB
fj
gj
hj
ij
Typ.
鈥撯€撯€?/div>
12.5
20
鈥撯€撯€?/div>
1.0
Max.
45
鈥撯€撯€?/div>
鈥撯€撯€?/div>
1.4
鈥撯€撯€?/div>
Units
擄C/W
Notes
聛
through
聢
are on page 10
www.irf.com
1
02/02/04
next
IRF6612TR1 產(chǎn)品屬性
1,000
分離式半導(dǎo)體產(chǎn)品
FET - 單
HEXFET®
MOSFET N 通道,金屬氧化物
邏輯電平門
30V
24A
3.3 毫歐 @ 24A,10V
2.25V @ 250µA
45nC @ 4.5V
3970pF @ 15V
2.8W
表面貼裝
DirectFET? 等容 MX
DIRECTFET? MX
帶卷 (TR)
IRF6612TR1相關(guān)型號PDF文件下載
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型號
版本
描述
廠商
下載
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INTERSIL [...
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FAIRCHILD
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英文版
5.0A, 200V, 0.800 Ohm, N-Channel Power MOSFET
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英文版
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英文版
Power MOSFET
TRSYS
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英文版
5.0A, 200V, 0.800 Ohm, N-Channel Power MOSFET
INTERSIL [...
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英文版
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