PD - 94727B
IRF6608
l
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Application Specific MOSFETs
Ideal for CPU Core DC-DC Converters
Low Conduction Losses
Low Switching Losses
Low Profile (<0.7 mm)
Dual Sided Cooling Compatible
Compatible with existing Surface Mount Techniques
HEXFET
廬
Power MOSFET
V
DSS
30V
R
DS(on)
max
9.0m鈩V
GS
= 10V
11m鈩V
GS
= 4.5V
Qg
16nC
ST
Applicable DirectFET Outline and Substrate Outline (see p.7, 8 for details)
SQ
SX
ST
MQ
MX
MT
DirectFET聶 ISOMETRIC
Description
The IRF6608 combines the latest HEXFET廬 Power MOSFET Silicon technology with the advanced DirectFET
TM
packaging to
achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET
package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase,
infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and
processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, IMPROVING previous
best thermal resistance by 80%.
The IRF6608 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and
switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest
generation of processors operating at higher frequencies. The IRF6608 has been optimized for parameters that are critical in
synchronous buck converters including Rds(on), gate charge and Cdv/dt-induced turn on immunity. The IRF6608 has been
optimized for parameters that are critical in synchronous buck converters including Rds(on) and gate charge to minimize losses in
the control FET socket.
Absolute Maximum Ratings
Parameter
V
DS
V
GS
I
D
@ T
C
= 25擄C
I
D
@ T
A
= 25擄C
I
D
@ T
A
= 70擄C
I
DM
P
D
@T
A
= 25擄C
P
D
@T
A
= 70擄C
P
D
@T
C
= 25擄C
T
J
T
STG
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
c
Power Dissipation
g
Power Dissipation
g
Power Dissipation
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Max.
30
鹵12
55
13
10
100
2.1
1.4
42
0.017
-40 to + 150
Units
V
A
W
W/擄C
擄C
Thermal Resistance
Parameter
R
胃JA
R
胃JA
R
胃JA
R
胃JC
R
胃J-PCB
Junction-to-Ambient
fj
Junction-to-Ambient
gj
Junction-to-Ambient
hj
Junction-to-Case
ij
Junction-to-PCB Mounted
Typ.
鈥撯€撯€?/div>
12.5
20
鈥撯€撯€?/div>
1.0
Max.
58
鈥撯€撯€?/div>
鈥撯€撯€?/div>
3.0
鈥撯€撯€?/div>
Units
擄C/W
Notes
聛
through
聢
are on page 2
www.irf.com
1
3/31/04
next
IRF6608 產品屬性
4,800
分離式半導體產品
FET - 單
HEXFET®
MOSFET N 通道,金屬氧化物
邏輯電平門
30V
13A
9 毫歐 @ 13A,10V
3V @ 250µA
24nC @ 4.5V
2120pF @ 15V
2.1W
表面貼裝
DirectFET? 等容 ST
DIRECTFET? ST
帶卷 (TR)
IRF6608TR
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