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Bulletin I0149J rev. E 06/05

IR1H40CSP

Flipky

TM

1 Amp

Features

Ultra Low V

F

per Footprint Area

Low Leakage

Low Thermal Resistance

One-fifth Footprint of SMA

Super Low Profile (<.8mm)

Available Tested on Tape & Reel

Flipky

TM

Major Ratings and Characteristics

Characteristics

I

F(AV)

Rectangularwaveform

V

RRM

I

FSM

V

F

T

J

@ tp = 5 碌s sine

@ 1.0 Apk, T

J

=125擄C

range

Description

True chip-scale packaging is available from International

Rectifier. The IR1H40CSP surface-mount Schottky rectifier

has been designed for applications requiring low forward

drop and very small foot prints on PC boards. Typical

applications are in disk drives, switching power supplies,

converters, free-wheeling diodes, battery charging, and

reverse battery protection.

Small foot print, surface mountable

Low forward voltage drop

High frequency operation

Guard ring for enhanced ruggedness and long term

reliability

The Flipky

TM

package, is one-fifth the footprint of a

comparable SMA package and has a profile of less then

.8mm. Combined with the low thermal resistance of the die

level device, this makes the Flipky

TM

the best device for

application where printed circuit board space is at a

premium and in extremely thin application environments

such as battery packs, cell phones and PCMCIA cards.

IR1H40CSP Units

1.0

40

250

0.42

- 55 to 150

A

V

A

V

擄C

www.irf.com

1

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