鈥?/div>
High reliability.
Surface mountable.
Magnetically self shielded.
Nickel barrier plating virtually eliminates silver migration.
MECHANICAL SPECIFICATIONS*
Solderability:
90% coverage after 5 second dip in 235擄C
solder following 60 second preheat at 120擄C to 150擄C and
type R flux dip.
Resistance To Solder Heat:
10 seconds in 260擄C solder
after preheat and flux per above.
Terminal Strength:
0.6 kilograms (1.32 pounds) minimum
for 30 seconds.
Beam Strength:
1 kilogram (2.2 pounds) minimum.
Flex:
0.079鈥?[2mm] minimum mounted on 0.063鈥?[1.6mm]
thick PC board.
ENVIRONMENTAL SPECIFICATIONS*
Operating Temperature:
- 55擄C to + 125擄C.
Thermal Shock:
100 cycles, - 40擄C to + 125擄C.
Biased Humidity:
85% RH at 85擄C, 1000 hours at full
rated current.
STANDARD ELECTRICAL SPECIFICATIONS
Z @ 100 MHz
(
鹵
25%)
7
11
17
26
32
40
50
60
75
80
90
100
120
150
180
220
300
400
420
600
1000
1500
2000
2200
DCR MAX.
(Ohms)
0.06
0.06
0.06
0.06
0.06
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.15
0.20
0.20
0.20
0.30
0.30
0.30
0.35
0.40
0.50
0.60
RATED DC CURRENT
(mA)
600
600
600
600
600
300
300
300
300
300
300
300
300
300
200
200
200
200
200
200
100
100
80
80
DIMENSIONS
in inches [millimeters]
Dimensional Outline
B
Ferrite
Body
A
D
C
A
0.079
鹵
0.008
[2.0
鹵
0.2]
B
0.049
鹵
0.008
[1.25
鹵
0.2]
C
0.020
鹵
0.012
[0.5
鹵
0.3]
D
0.035
鹵
0.008
[0.9
鹵
0.2]
Suggested Pad Layout
G
PACKAGING OPTIONS
鈥?Tape and Reel:
Embossed plastic carrier tape.
Per EIA481-1.
4000 pieces on a 7" [178mm] reel.
F
H
E
DESCRIPTION
ILBB-0805
MODEL
11
IMPEDANCE
VALUE
鹵
25%
IMPEDANCE
TOLERANCE
E
0.120
[3.0]
F
0.039
[1.0]
G
0.039
[1.0]
H
0.039
[1.0]
SAP PART NUMBERING GUIDELINES (INTERNAL)
I
L
B
B
0
8
SIZE
0
5
R
K
1
1
IMPEDANCE
VALUE
0
V
TOL.
PRODUCT FAMILY
See the end of this data book for conversion tables
PACKAGE
CODE
www.vishay.com
80
For technical questions, contact Magnetics@vishay.com
Document Number 34025
Revision 15-Jan-03
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