鈥?/div>
Revolutionary semiconductor material -
Silicon Carbide
Switching behavior benchmark
No reverse recovery
No temperature influence on the switching
behavior
No forward recovery
High surge current capability
Applications:
鈥?/div>
SMPS, PFC, snubber
C
A
Chip Type
IDC04S60C
V
BR
600V
I
F
4A
Die Size
1.146 x 0.968 mm
2
Package
sawn on foil
MECHANICAL PARAMETER:
Raster size
Anode pad size
Area total / active
Thickness
Wafer size
Flat position
Max. possible chips per wafer
Passivation frontside
Anode metalization
Cathode metalization
Die bond
Wire bond
Reject Ink Dot Size
Recommended Storage Environment
1.146x 0.968
mm
0.909 x 0.731
1.11 / 0.74
355
75
0
3461 pcs
Photoimide
3200 nm Al
1400 nm Ni Ag 鈥搒ystem
suitable for epoxy and soft solder die bonding
Electrically conductive glue or solder
Al,
鈮?/div>
350碌m
鈭?鈮?/div>
0.3 mm
store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23擄C
mm
碌m
mm
deg
2
Edited by INFINEON Technologies, AIM PMD D CID CLS, Edition 1, 05.04.2006
next