鈥?/div>
An optimal solution for antenna switching in mobile phones.
Low capacitance. (C = 0.35 pF max)
Low forward resistance. (rf = 1.3
鈩?/div>
max)
Thin Extremely small Flat Lead Package (TEFP) is suitable for surface mount design.
Ordering Information
Type No.
HVL142AM
Laser Mark
J
Package Name
TEFP
Package Code
PUSF0002ZA-A
Pin Arrangement
Cathode mark
Mark
1
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J
2
1. Cathode
2. Anode
Rev.2.00 Jan 19, 2006 page 1 of 5
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