HUF75939P3, HUF75939S3ST
Data Sheet
December 2001
22A, 200V, 0.125 Ohm, N-Channel,
UltraFET廬 Power MOSFET
Packaging
JEDEC TO-220AB
SOURCE
DRAIN
GATE
GATE
SOURCE
DRAIN
(FLANGE)
Features
JEDEC TO-263AB
DRAIN
(FLANGE)
鈥?Ultra Low On-Resistance
鈥?r
DS(ON)
= 0.125鈩?
V
GS
= 10V
鈥?Simulation Models
- Temperature Compensated PSPICE廬 and SABER漏
Electrical Models
- Spice and SABER漏 Thermal Impedance Models
鈥?www.fairchildsemi.com
HUF75939P3
HUF75939S3ST
鈥?Peak Current vs Pulse Width Curve
鈥?UIS Rating Curve
Symbol
D
Ordering Information
PART NUMBER
HUF75939P3
PACKAGE
TO-220AB
TO-263AB
BRAND
75939P
75939S
G
HUF75939S3ST
S
NOTE: When ordering, use the entire part number.
Absolute Maximum Ratings
T
C
= 25
o
C, Unless Otherwise Specified
HUF75939P3, HUF75939S3ST
UNITS
V
V
V
A
A
200
200
鹵20
22
16
Figure 4
Figures 6, 14, 15
180
1.2
-55 to 175
300
260
W
W/
o
C
o
C
o
C
o
C
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
Drain to Gate Voltage (R
GS
= 20k鈩? (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Drain Current
Continuous (T
C
= 25
o
C, V
GS
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
C
= 100
o
C, V
GS
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
L
Package Body for 10s, See Tech Brief TB334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
pkg
NOTE:
1. T
J
= 25
o
C to 150
o
C.
CAUTION:
Stresses above those listed in
鈥淎bsolute
Maximum Ratings鈥?may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
漏2001 Fairchild Semiconductor Corporation
HUF75939P3, HUF75939S3ST Rev. B