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HSMD-S670 Datasheet

  • HSMD-S670

  • SMT Top Mount S670

  • 11頁(yè)

  • ETC

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High Performance Surface Mount
Chip LEDs
Technical Data
SunPower Series
HSMx-S660 Series
HSMx-S670 Series
HSMx-S690 Series
Features
鈥?High Brightness AlInGaP
Material
鈥?Industry Standard 2.00 x
1.25 mm Package
鈥?Industry Standard 1.6 x 0.8
mm (Low Profile) Package
鈥?Right Angle Package
鈥?Three Colors Available
鈥?Diffused Optics
鈥?Compatible with IR Solder
Process
鈥?Available in 8 mm Tape on
7鈥?(178 mm) Diameter Reels
Description
These chip-type LEDs utilize
aluminum indium gallium
phosphide (AlInGaP) material
technology. The AlInGaP material
has a very high luminous
efficiency, capable of producing
high light output over a wide
range of drive currents. The 590
nm amber, 605 nm orange, and
626 nm red colors are available
in three compact, low profile
packages.
The HSMx-S670 is the industry
standard 2.0 x 1.25 mm package,
and is an excellent all around
package. The HSMx-S690 is the
industry standard 1.6 x 0.8 mm
package. Its low 0.7 mm profile
and wide viewing angle make this
LED excellent for backlighting
applications. The HSMx-S660
right angle, 3.0 x 2.0 x 1.0 mm
LED is optimum for side lighting
applications where direct back-
lighting is not practical.
All packages are compatible with
IR and convective reflow solder-
ing processes.
Applications
鈥?Keypad Backlighting
鈥?LCD Backlighting
鈥?Symbol Backlighting
鈥?Front Panel Indicator
Device Selection Guide
Footprint
(mm)
[1][2]
1.6 x 0.8 x 0.7
2.0 x 1.25 x 0.8
3.0 x 2.0 x 1.0
Amber
590 nm
HSMA-S690
HSMA-S670
HSMA-S660
Orange
605 nm
HSMD-S690
HSMD-S670
HSMD-S660
Red
626 nm
HSMC-S690
HSMC-S670
HSMC-S660
Notes:
1. Dimensions in mm.
2. Tolerance
鹵
0.1 mm unless otherwise noted.

HSMD-S670 產(chǎn)品屬性

  • Product Obsolescence 03/Jan/2008

  • 4,000

  • 光電元件

  • LED -

  • SunPower

  • 橙

  • 65mcd

  • 1.9V

  • 20mA

  • 605nm

  • 609nm

  • 165°

  • 散射

  • 矩形，帶平頂，1.2mm x 0.8mm

  • 0805（2012 公制）

  • 2.00mm L x 1.25mm W

  • 0.80mm

  • 表面貼裝

  • 帶卷 (TR)

  • -

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