鈥?typically 6鈩?/div>
Chip Size:
Chip Size Tolerance:
Chip Thickness:
Chip Thickness Tol:
Bond Pad Sizes:
610 x 255
碌m
(24 x 10 mils)
鹵10 碌m
(鹵0.4 mils)
100
碌m
(4 mils)
鹵15 碌m
(鹵0.6 mils)
175 x 175
碌m
(6.9 x 6.9 mils)
鈥?High cut-off frequency
鈥?Polyimide scratch protection
鈥?Durable construction
鈥?Large bond pads suitable for
automated wire bonding or flip-
chip assembly
Description
The HSCH-9401 is a discrete
Schottky barrier diode fabricated
with the Schottky Barrier Inte-
grated Diode (SBID) process.
Applications
The HSCH-9401 is a general
purpose millimeter wave diode
that can be used as a detector or
as a mixer in applications such
as digital radio, LMDS, or video
distribution.
Assembly Techniques
Diodes are ESD sensitive. ESD
preventive measures must be
employed in all aspects of
storage, handling, and assembly.
Diode ESD precautions, handling
considerations, die attach and
bonding methods are critical
factors in successful diode
performance and reliability.
Specifications
鈥?V
f
(1 mA): 630 鈥?800 mV
鈥?V
f
(10 mA): 730 鈥?980 mV
鈥?R
S
(5 mA): < 20鈩?/div>
鈥?B
V
(-10
碌A):
> 6 V
Agilent application note #54,
鈥淕aAs MMIC ESD, Die Attach
and Bonding Guidelines鈥?pro-
vides basic information on these
subjects.
Additional References
PN #1, 鈥淗SCH-9401 Diode
Model,鈥?and PN# 16, 鈥淗SCH-9401
Detector Sensitivity Measure-
ments.鈥?/div>
鈥?I
r
(-2V): < 200 nA
鈥?C
t
: < 0.045 pF
1
2
