Small Signal RF PIN Diode Chips
for Hybrid Integrated Circuits
Technical Data
HPND-0001
HPND-0002
Features
鈥?Thermocompression/
Thermosonically Bondable
鈥?Ideal for Hybrid Integrated
Circuits
鈥?Gold Metallization
鈥?Silicon Nitride Passivation
鈥?Uniform Electrical
Characteristics
鈥?Batch Matched Versions
Available
鈥?Planar Construction
Description
These PIN/NIP diode chips are
specifically designed for hybrid
applications requiring thermo-
sonic or thermocompression
bonding techniques. The top
metallization is a layer of gold for
a tarnish free surface that allows
either thermosonic or
thermocompression bonding
techniques. The bottom metalli-
zation is also gold, suitable for
epoxy or eutectic die attach
method.
Outline 01B
Chip Dimensions
D
X
X
Y
Applications
These small signal, general
purpose PIN/NIP diode chips are
optimized for various analog and
digital applications such as
switches, digital phase shifters,
pulse and amplitude modulators,
limiters, leveling, and attenuating.
FOR EPOXY OR EUTECTIC
DIE ATTACH
PART NO. HPND-
DIMENSIONS
-0001
-0002
0.25
D
0.20
(10)
(8)
(0.03) (1)
X
0.51
0.38
(0.05) (2)
(20)
(15)
Y
0.15
0.15
(0.03) (1)
(6)
(6)
CATHODE
TOP CONTACT CATHODE
ANODE
ANODE
BOTTOM
CONTACT
DIMENSIONS IN MILLIMETERS (1/1000 INCH).
2-93
5965-9143E
1
2
