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HIP6602BCB Datasheet

  • HIP6602BCB

  • Dual Channel Synchronous Rectified Buck MOSFET Driver

  • 12頁(yè)

  • INTERSIL   INTERSIL

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I GN S
EW DES
D FOR N
ME N D E OMME N D S :
C OM
,
NOT RE TERSIL REC
L6613A
IN
Data
L6613, IS
Sheet
12A, IS
2, ISL66 4, ISL6614A
ISL661
ISL661
HIP6602B
July 22, 2005
FN9076.5
Dual Channel Synchronous Rectified
Buck MOSFET Driver
The HIP6602B is a high frequency, two power channel
MOSFET driver specifically designed to drive four power
N-Channel MOSFETs in a synchronous rectified buck
converter topology. This device is available in either a
14-lead SOIC or a 16-lead QFN package with a PAD to
thermally enhance the package. These drivers combined
with a HIP63xx or ISL65xx series of Multi-Phase Buck PWM
controllers and MOSFETs form a complete core voltage
regulator solution for advanced microprocessors.
The HIP6602B drives both upper and lower gates over a
range of 5V to 12V. This drive-voltage flexibility provides the
advantage of optimizing applications involving trade-offs
between switching losses and conduction losses.
The output drivers in the HIP6602B have the capacity to
efficiently switch power MOSFETs at high frequencies. Each
driver is capable of driving a 3000pF load with a 30ns
propagation delay and 50ns transition time. This device
implements bootstrapping on the upper gates with a single
external capacitor and resistor required for each power
channel. This reduces implementation complexity and allows
the use of higher performance, cost effective, N-Channel
MOSFETs. Adaptive shoot-through protection is integrated
to prevent both MOSFETs from conducting simultaneously.
Features
鈥?Drives Four N-Channel MOSFETs
鈥?Adaptive Shoot-Through Protection
鈥?Internal Bootstrap Devices
鈥?Supports High Switching Frequency
- Fast Output Rise Time
- Propagation Delay 30ns
鈥?Small 14-Lead SOIC Package
鈥?Smaller 16-Lead QFN Thermally Enhanced Package
鈥?5V to 12V Gate-Drive Voltages for Optimal Efficiency
鈥?Three-State Input for Bridge Shutdown
鈥?Supply Undervoltage Protection
鈥?Pb-Free Plus Anneal Available (RoHS Compliant)
鈥?QFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile
Applications
鈥?Core Voltage Supplies for Intel Pentium廬 III and AMD廬
Athlon
TM
Microprocessors.
Ordering Information
PART NUMBER
HIP6602BCB
HIP6602BCB-T
HIP6602BCBZ (Note 1)
HIP6602BCBZ-T (Note 1)
HIP6602BCR
HIP6602BCR-T
HIP6602BCRZ (Note 1)
HIP6602BCRZ-T (Note 1)
HIP6602BCRZA (Note 1)
TEMP.
RANGE (擄C)
0 to 85
PACKAGE
14 Ld SOIC
PKG.
DWG. #
M14.15
鈥?High-Frequency, Low-Profile DC/DC Converters
鈥?High-Current, Low-Voltage DC/DC Converters
14 Ld SOIC Tape and Reel
0 to 85
14 Ld SOIC
(Pb-Free)
M14.15
14 Ld SOIC Tape and Reel (Pb-Free)
0 to 85
16 Ld 5x5 QFN
L16.5x5
16 Ld 5x5 QFN Tape and Reel
0 to 85
16 Ld 5x5 QFN
(Pb-Free)
L16.5x5
16 Ld 5x5 QFN Tape and Reel (Pb-Free)
0 to 85
16 Ld 5x5 QFN
(Pb-Free)
L16.5x5
HIP6602BCRZA-T (Note 1) 16 Ld 5x5 QFN Tape and Reel (Pb-Free)
NOTE:
1. Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2002-2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
1

HIP6602BCB 產(chǎn)品屬性

  • 50

  • 集成電路 (IC)

  • PMIC - MOSFET,電橋驅(qū)動(dòng)器 - 外部開(kāi)關(guān)

  • -

  • 高端和低端,同步

  • PWM

  • -

  • 400mA

  • 2

  • 4

  • 15V

  • 10.8 V ~ 13.2 V

  • 0°C ~ 85°C

  • 表面貼裝

  • 14-SOIC(0.154",3.90mm 寬)

  • 14-SOICN

  • 管件

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