鈥?/div>
Operating Junction Temperature: -55擄C to +150擄C
Storage Temperature: -55擄C to +150擄C
Typical Thermal Resistance 75擄C/W Junction to ambient
MCC
Catalog
Number
HD01
HD02
HD04
HD06
HD08
HD10
Device
Marking
Maximum
Recurrent
Peak Reverse
Voltage
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
70V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
100V
200V
400V
600V
800V
1000V
G
I
HD01
HD02
HD04
HD06
HD08
HD10
A
F
E
B
DIMENSIONS
INCHES
MIN
.177
.091
---
.142
.091
---
.020
.028
.006
MM
MIN
4.50
2.30
---
3.60
2.30
---
0.50
0.70
0.15
Electrical Characteristics @ 25擄C Unless Otherwise Specified
Average Forward
Current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Typical Junction
Capacitance
I
F(AV)
I
FSM
0.8 A
30A
T
A
= 40擄C
8.3ms, half sine
DIM
A
B
C
D
E
F
G
H
I
MAX
.193
.106
.276
.157
.106
.008
.031
.043
.014
MAX
4.90
2.70
7.00
4.00
2.70
0.20
0.80
1.10
0.35
NOTE
V
F
1.0V
I
FM
= 0.4A;
T
A
= 25擄C
T
J
= 25擄C
T
J
= 125擄C
Suggested Solder Pad
Layout
.030鈥滿IN
I
R
C
J
5碌A(chǔ)
0.5mA
15pF
.272鈥滿AX
Measured at
1.0MHz, V
R
=4.0V
.023鈥滿IN
*Pulse Test: Pulse Width 300碌sec, Duty Cycle 1%
.105鈥?/div>
.095鈥?/div>
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