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HCTS273D Datasheet

  • HCTS273D

  • Radiation Hardened Octal D Flip-Flop

  • 10頁

  • INTERSIL   INTERSIL

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HCTS273MS
September 1995
Radiation Hardened
Octal D Flip-Flop
Pinouts
20 LEAD CERAMIC DUAL-IN-LINE
METAL SEAL PACKAGE (SBDIP)
MIL-STD-1835 CDIP2-T20, LEAD FINISH C
TOP VIEW
MR
Q0
D0
D1
Q1
Q2
D2
D3
Q3
1
2
3
4
5
6
7
8
9
20 VCC
19 Q7
18 D7
17 D6
16 Q6
15 Q5
14 D5
13 D4
12 Q4
11 CP
Features
鈥?3 Micron Radiation Hardened CMOS SOS
鈥?Total Dose 200K RAD (Si)
鈥?SEP Effective LET No Upsets: >100 MEV-cm
2
/mg
鈥?Single Event Upset (SEU) Immunity < 2 x 10
-9
Errors/Bit-
Day (Typ)
鈥?Dose Rate Survivability: >1 x 10
12
RAD (Si)/s
鈥?Dose Rate Upset >10
10
RAD (Si)/s. 20ns Pulse
鈥?Latch-Up Free Under Any Conditions
鈥?Fanout (Over Temperature Range)
- Bus Driver Outputs - 15 LSTTL Loads
鈥?Military Temperature Range: -55
o
C to +125
o
C
鈥?Signi鏗乧ant Power Reduction Compared to LSTTL ICs
鈥?DC Operating Voltage Range: 4.5V to 5.5V
鈥?LSTTL Input Compatibility
- VIL = 0.8V Max
- VIH = VCC/2 Min
鈥?Input Current Levels Ii
鈮?/div>
5碌A(chǔ) at VOL, VOH
GND 10
20 LEAD CERAMIC METAL SEAL
FLATPACK PACKAGE (FLATPACK)
MIL-STD-1835 CDFP4-F20, LEAD FINISH C
TOP VIEW
MR
Q0
D0
D1
Q1
Q2
D2
D3
Q3
GND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VCC
Q7
D7
D6
Q6
Q5
D5
D4
Q4
CP
Description
The Intersil HCTS273MS is a Radiation Hardened octal D 鏗俰p-
鏗俹p, positive edge triggered, with reset.
The HCTS273MS utilizes advanced CMOS/SOS technology to
achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family.
The HCTS273MS is supplied in a 20 lead Ceramic 鏗俛tpack
(K suf鏗亁) or a SBDIP Package (D suf鏗亁).
Ordering Information
PART NUMBER
HCTS273DMSR
HCTS273KMSR
HCTS273D/Sample
HCTS273K/Sample
HCTS273HMSR
TEMPERATURE RANGE
-55
o
C to +125
o
C
-55
o
C to +125
o
C
+25
o
C
+25
o
C
+25
o
C
SCREENING LEVEL
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
Sample
Die
PACKAGE
20 Lead SBDIP
20 Lead Ceramic Flatpack
20 Lead SBDIP
20 Lead Ceramic Flatpack
Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com
|
Copyright
漏
Intersil Corporation 1999
Spec Number
File Number
1
518642
2274.2

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