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HCPL-M454 Datasheet

  • HCPL-M454

  • Ultra High CMR, Small Outline, 5 Lead, High Speed Optocouple...

  • 83.26KB

  • 12頁(yè)

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Ultra High CMR, Small Outline,
5 Lead, High Speed Optocoupler
Technical Data
HCPL-M454
Features
鈥?Function Compatible with
HCPL-4504
鈥?Surface Mountable
鈥?Very Small, Low Profile
JEDEC Registered
Package Outline
鈥?Compatible with Infrared
Vapor Phase Reflow and
Wave Soldering Processes
鈥?Short Propagation Delays
for TTL and IPM
Applications
鈥?Very High Common Mode
Transient Immunity:
Guaranteed 15 kV/
碌
s at
V
CM
= 1500 V
鈥?High CTR: >25% at 25
擄
C
鈥?Guaranteed Specifications
for Common IPM
Applications
鈥?TTL Compatible
鈥?Guaranteed ac and dc
Performance Over
Temperature: 0
擄
C to 70
擄
C
鈥?Open Collector Output
鈥?Recognized Under the
Component Program of
U.L. (File No. E55361) for
Dielectric Withstand Proof
Test Voltage of 3750 Vac. 1
Minute
鈥?Lead Free Option 鈥?000E鈥?/div>
Applications
鈥?Inverter Circuits and
Intelligent Power Module
(IPM) Interfacing -
Shorter
propagation delays and
guaranteed (t
PLH
- t
PHL
)
specifications. (See Power
Inverter Dead Time section).
鈥?High Speed Logic Ground
Isolation - TTL/TTL, TTL/
LTTL, TTL/CMOS, TTL/
LSTTL
鈥?Line Receivers -
High com-
mon mode transient immunity
(>15 kV/碌s for a TTL load/
drive) and low input-output
capacitance (0.6 pF).
鈥?Replace Pulse Trans-
formers -
Save board space
and weight
鈥?Analog Signal Ground
Isolation -
Integrated photon
detector provides improved
linearity over phototransistors
Outline Drawing (JEDEC MO-155)
ANODE 1
4.4 鹵 0.1
(0.173 鹵 0.004)
6
V
CC
MXXX
XXX
7.0 鹵 0.2
(0.276 鹵 0.008)
CATHODE 3
5 V
OUT
4
GND
TYPE NUMBER (LAST 3 DIGITS)
0.4 鹵 0.05
(0.016 鹵 0.002)
3.6 鹵 0.1*
(0.142 鹵 0.004)
0.102 鹵 0.102
(0.004 鹵 0.004)
0.15 鹵 0.025
(0.006 鹵 0.001)
DATE CODE
2.5 鹵 0.1
(0.098 鹵 0.004)
1.27 BSC
(0.050)
0.71 MIN.
(0.028)
MAX. LEAD COPLANARITY
= 0.102 (0.004)
DIMENSIONS IN MILLIMETERS (INCHES)
* MAXIMUM MOLD FLASH ON EACH SIDE IS 0.15 mm (0.006)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
CAUTION: The small junction sizes inherent to the design of this bipolar component increase the component's
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken
in handling and assembly of this component to prevent damage and/or degradation which may be induced by
ESD.

HCPL-M454 產(chǎn)品屬性

  • HCPL-M454

  • 100

  • 隔離器

  • 光隔離器 - 晶體管，光電輸出

  • -

  • 1

  • DC

  • 3750Vrms

  • 25% @ 16mA

  • 60% @ 16mA

  • 20V

  • 8mA

  • 25mA

  • -

  • 有 Vcc 的晶體管

  • 表面貼裝

  • 6-SOIC（0.173"，4.40mm 寬，5 引線）

  • 管件

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