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Improved Shoot-Through FOM
D
Internal Schematic
Diagram
G
S
Maximum Ratings & Thermal Characteristics
(T
A
=25
o
C unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
*1
Maximum Power Dissipation
T
A
=25
o
C
T
A
=75
o
C
Symbol
V
DS
V
GS
I
D
I
DM
P
D
T
J
,T
stg
E
AS
R
胃JC
R
胃JA
Value
25
鹵20
35
140
57
23
-55 to 150
300
2.2
50
O
O
Units
V
V
A
A
W
W
o
Operating Junction and Storage Temperature Range
Avalanche Energy with Single Pulse
I
D
=35A, V
DD
=20V, L=0.14mH
Junction-to-Case Thermal Resistance
Junction-to-Ambient Thermal Resistance(PCB mounted)
*2
*1: Maximum DC current limited by the package.
*2: 1-in
2
2oz Cu PCB board
C
mJ
C/W
C/W
Switching
Test Circuit
V
DD
Switching
Waveforms
ton
td(on)
toff
tr td(off)
90%
tf
90 %
V
IN
V
GEN
R
G
G
D
V
OUT
Output, V
OUT
10%
10%
Inverted
90%
50%
50%
S
Input, V
IN
10%
Pulse Width
H35N03J
HSMC Product Specification