H22L SERIES
OPTOLOGIC廬 OPTICAL
INTERRUPTER SWITCH
PACKAGE DIMENSIONS
0.472 (12.0)
0.457 (11.6)
0.249 (6.35)
0.243 (6.15)
+
E
D
+
C
L
0.39 (1.00)
0.34 (0.85)
C
L
0.129 (3.3)
0.119 (3.0)
0.103 (2.60) NOM
0.433 (11.0)
0.422 (10.7)
Optical
C
L
FEATURES
鈥?Black plastic housing
鈥?Choice of inverter or buffer output functions
鈥?Choice of open-collector or totem-pole output configuration
0.315 (8.0)
C
L
鈥?No contact switching
鈥?TTL/CMOS compatible output functions
0.055 (1.40)
0.045 (1.14)
0.055 (1.40)
0.045 (1.14)
0.110 (2.8)
0.091 (2.3)
PIN 1 ANODE
PIN 2 CATHODE
2
3
4
1
5
PART NUMBER DEFINITIONS
H22LTB
H22LTI
H22LOB
H22LOI
Totem-pole, buffer output
Totem-pole, inverter output
Open-collector, buffer output
Open-collector, inverter output
(Applies to Max Ratings and Characteristics Tables.)
0.295 (7.5)
0.272 (6.9)
PIN 3 V
CC
PIN 4 V
O
0.020 (0.51) (SQ)
PIN 5 GND
NOTES
NOTES:
1. Dimensions for all drawings are in inches (millimeters).
2. Tolerance of 鹵 .010 (.25) on all non-nominal dimensions
unless otherwise specified.
3. Lead cross section is controlled between .050 (1.27) from
the seating plane and the end of the leads.
1. Derate power dissipation linearly 1.67 mW/擄C above 25擄C.
2. Derate power dissipation linearly 2.50 mW/擄C above 25擄C.
3. RMA flux is recommended.
4. Methanol or isopropyl alcohols are recommended as
cleaning agents.
5. Soldering iron
1/16鈥?/div>
(1.6mm) from housing.
6. As long as leads are not under any stress or spring tension.
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating Temperature
Storage Temperature
Soldering Temperature (Iron)
(3,4,5,6)
Soldering Temperature (Flow)
(3,4,6)
EMITTER
Continuous Forward Current
Reverse Voltage
Power Dissipation
(1)
SENSOR
Output Current
Supply Voltage
Output Voltage
Power Dissipation
(1)
(T
A
= 25擄C unless otherwise specified)
Symbol
T
OPR
T
STG
T
SOL-I
T
SOL-F
I
F
V
R
P
D
I
O
V
CC
V
O
P
D
Rating
-40 to +85
-40 to +85
240 for 5 sec
260 for 10 sec
50
5
100
50
4.0 to 16
30
150
Units
擄C
擄C
擄C
擄C
mA
V
mW
mA
V
V
mW
1 of 5
100011B
1
2
3
4
5
