October 1995
GTL Logic
KEY
T
e
available in JEDEC
e
available in EIAJ
e
available in JEDEC and EIAJ
e
available in wide format
e
available in standard and
e
T
e
w
T
w
wide format
Pw
e
planned in standard
available in wide format
e
military temperature range
Z
F
e
military temperature range and MIL-STD-883
e
military temperature range MIL-STD-883
and SMD
e
military temperature range MIL-STD-883
SMD MIL S
O
e
military temperature range and SMD
e
MIL-STD-883
e
SMD
e
MIL-STD-883 and SMD
e
MIL-STD-883 SMD MIL S
e
MIL-STD-883 SMD JAN B
e
MIL-STD-883 and JAN B
D
X
V
U
e
MIL-STD-883 JAN B and JAN S
e
MIL-STD-883 SMD JAN B and JAN S
e
MIL-STD-883 SMD JAN B JAN S and
RHA qualified as 鈥樷€楻鈥欌€?/div>
P
TBA
CDIP
PDIP
FPAK
e
Planned
e
To Be Announced
e
Ceramic Dual In-Line Package
e
Plastic Dual In-Line Package
e
Ceramic Flatpak
MQUAD
e
Metal Quad Flatpak
e
Quad Flatpak
PQFP
e
Ceramic Leadless Chip Carrier
LCC
e
Small Outline Integrated Circuit
SOIC
SSOP
QSOP
PPGA
1
2
3
4
5
e
Small Shrink Outline Package
e
Quarter Size Outline Package
e
Plastic Pin Grid Array
e
CDIP standard package 400-mil wide
e
Also in 600-mil wide DIP
e
300-mil wide
e
20-lead package
e
400-mil wide
Commercial package width standards
8- 14- 16-lead SOIC
e
150-mil wide
20- 24- 28-lead SOIC
e
300-mil wide
8- 14- 16- 20- 24-lead PDIP
e
300-mil wide
28-lead PDIP
e
600-mil wide
1
1
2
