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High temperature soldering guaranteed:
350擄C/10 seconds 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
P
A
T
E
N
T
E
1.0 (25.4)
MIN.
0.210 (5.3)
0.190 (4.8)
DIA.
0.375 (9.5)
0.285 (7.2)
0.052 (1.32)
0.048 (1.22)
DIA.
1.0 (25.4)
MIN.
Dimensions in inches and (millimeters)
MECHANICAL DATA
Case:
JEDEC DO-201AD molded plastic over glass body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.04 ounce, 1.12 grams
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306
廬
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
GP
30A
GP
30B
GP
30D
GP
30G
GP
30J
GP
30K
GP
30M
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=55擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 3.0A
Maximum reverse current
at rated DC blocking voltage
T
A
=25擄C
T
A
=150擄C
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
200
140
200
400
280
400
3.0
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
Amps
I
FSM
V
F
I
R
I
R(AV)
t
rr
C
J
R
螛JA
R
螛JL
T
J
, T
STG
1.2
125.0
1.1
5.0
100.0
100.0
3.0
40.0
20.0
10.0
-65 to +175
Amps
Volts
碌A(chǔ)
碌A(chǔ)
碌s
pF
擄C/W
擄C
Maximum full load reverse current, full cycle average
0.375" (9.5mm) lead length at T
A
=55擄C
Maximum reverse recovery time
Typical junction capacitance
Typical thermal resistance
(NOTE 1)
(NOTE 2)
(NOTE 3)
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5mm) lead length, P.C.B. mounted
4/98
1
2
