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High temperature soldering guaranteed:
350擄C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
T
E
D
P
A
T
E
N
1.0 (25.4)
MIN.
0.107 (2.7)
0.080 (2.0)
DIA.
0.205 (5.2)
0.160 (4.1)
1.0 (25.4)
MIN.
0.034 (0.86)
0.028 (0.71)
DIA.
NOTE:
Lead diameter is
0.026 (0.66)
0.023 (0.58)
for suffix "E" part numbers
MECHANICAL DATA
Case:
JEDEC DO-204AL molded plastic over glass body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.012 ounce, 0.3 gram
Dimensions in inches and (millimeters)
Glass-plastic encapsulation technique is covered by
Patent No.3,996,602 and brazed-lead assembly by Patent No.3,930,306
*
廬
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
GP08A
GP08B
GP08D
GP08G
GP08J
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=55擄C
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) at T
A
=55擄C
Maximum instantaneous forward voltage at 0.8A
Maximum full load reverse current full cycle
average 0.375" (9.5mm) lead length at T
A
=55擄C
Maximum DC reverse current
at rated DC blocking voltage
Typical reverse recovery time
(NOTE 1)
Typical junction capacitance
Typical thermal resistance
(NOTE 2)
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
200
140
200
0 .8
400
280
400
600
420
600
Volts
Volts
Volts
Amp
I
FSM
V
F
I
R(AV)
I
R
t
rr
C
J
R
螛JA
T
J
, T
STG
25.0
1.3
30.0
5.0
50.0
2.0
8.0
55.0
-65 to +175
Amps
Volts
碌A(chǔ)
碌A(chǔ)
碌s
pF
擄C/W
擄C
T
A
=25擄C
T
A
=125擄C
(NOTE 3)
Operating junction and storage temperature range
NOTES:
(1) Measure on I
F
=0.5A, I
R
=1.0A, I
rr
= 0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
4/98
1
2
