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High temperature soldering guaranteed:
350擄C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
N
T
E
D
*
P
A
T
E
1.0 (25.4)
MIN.
0.107 (2.7)
0.080 (2.0)
DIA.
0.205 (5.2)
0.160 (4.1)
1.0 (25.4)
MIN.
0.034 (0.86)
0.028 (0.71)
DIA.
MECHANICAL DATA
Case:
JEDEC DO-204AL molded plastic over glass body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.012 ounce, 0.3 gram
Dimensions in inches and (millimeters)
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306
*
廬
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
GP02
-20
GP02
-25
GP02
-30
GP02
-35
GP02
-40
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS Voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=55擄C
Peak forward surge current
8.3ms single half sine-wave superimposed on rated load at:
(JEDEC Method)
T
A
=55擄C
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Typical reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
Typical thermal resistance
(NOTE 3)
V
RRM
V
RMS
V
DC
I
(AV)
2000
1400
2000
2500
1750
2500
3000
2100
3000
0.25
3500
2450
3500
4000
2800
4000
Volts
Volts
Volts
Amp
I
FSM
V
F
I
R
t
rr
C
J
R
螛JA
T
J
, T
STG
15.0
3.0
5.0
50.0
2.0
3.0
130.0
-65 to +175
Amps
Volts
碌A(chǔ)
碌s
pF
擄C/W
擄C
T
A
= 25擄C
T
A
=100擄C
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead lengths, P.C.B. mounted
4/98
1
2
